Inventor · disambiguated record

Masahiro Hatanai

Also filed as: HATANAI MASAHIRO

1 granted patent·0 citations·filing 2010–2010

4Inventor score

Technology areasH10W

Files withWATANABE MASAKAZU1

Top patents by PatentIndex Score

1 record

0126US8633511B2Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation materialWATANABE MASAKAZU·Filed 2010·Granted Jan 21, 2014·0 cites·6 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →