Inventor · disambiguated record
Naotake Watanabe
Also filed as: WATANABE NAOTAKE
14 granted patents·5 pending applications·270 citations·filing 1988–2017
90Inventor score
Files withTOSHIBA KK12NITTO CHEMICAL INDUSTRY CO LTD3NEC ELECTRONICS CORP2RENESAS ELECTRONICS CORP1TOMIOKA TAIZO1
Top patents by PatentIndex Score
19 records- 0195US6528870B2Semiconductor device having a plurality of stacked wiring boardsTOSHIBA KK·Filed 2001·Granted Mar 4, 2003·179 cites·9 claims
- 0282US4853198AProcess for producing unsintered cristobalite silicaNITTO CHEMICAL INDUSTRY CO LTD·Filed 1988·Granted Aug 1, 1989·32 cites·9 claims
- 0367US7558998B2Semiconductor apparatus and clock generation unitNEC ELECTRONICS CORP·Filed 2005·Granted Jul 7, 2009·5 cites·20 claims
- 0467US5154905AMethod for producing unsintered cristobalite particlesNITTO CHEMICAL INDUSTRY CO LTD·Filed 1991·Granted Oct 13, 1992·20 cites·16 claims
- 0566US6472734B2Stacked semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2001·Granted Oct 29, 2002·13 cites·10 claims
- 0660US7982299B2Power semiconductor moduleTOSHIBA KK·Filed 2008·Granted Jul 19, 2011·2 cites·5 claims
- 0755US5202104AProcess for preparing silica having a low silanol contentNITTO CHEMICAL INDUSTRY CO LTD·Filed 1990·Granted Apr 13, 1993·18 cites·15 claims
- 0852US2010075719A1Cellular phoneTOMIOKA TAIZO·Filed 2009·Application pending·0 cites
- 0947US2010006888A1Method of manufacturing optical semiconductor device, optical semiconductor device, and method of manufacturing optical semiconductor apparatusTOSHIBA KK·Filed 2009·Application pending·0 cites
- 1045US9496201B2Semiconductor device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2016·Granted Nov 15, 2016·0 cites·3 claims
- 1145US7750448B2Semiconductor package and method for manufacturing the sameTOSHIBA KK·Filed 2008·Granted Jul 6, 2010·0 cites·2 claims
- 1244US2017309566A1Semiconductor integrated circuit device and method of manufacturing semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1343US6797530B2Semiconductor device-manufacturing method for manufacturing semiconductor devices with improved heat radiating efficiency and similar in size to semiconductor elementsTOSHIBA KK·Filed 2002·Granted Sep 28, 2004·1 cites·6 claims
- 1442US9379040B2Semiconductor device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2015·Granted Jun 28, 2016·0 cites·3 claims
- 1541US9147673B2Semiconductor power converter and method of manufacturing the sameTOSHIBA KK·Filed 2013·Granted Sep 29, 2015·0 cites·8 claims
- 1639US8872327B2Semiconductor deviceTOSHIBA KK·Filed 2013·Granted Oct 28, 2014·0 cites·12 claims
- 1739US2006164813A1Semiconductor package and semiconductor moduleTOSHIBA KK·Filed 2005·Application pending·0 cites
- 1832US11088118B2Semiconductor deviceTOSHIBA KK·Filed 2017·Granted Aug 10, 2021·0 cites·9 claims
- 1931US2010225330A1Method of testing electric fuse, and electric fuse circuitNEC ELECTRONICS CORP·Filed 2010·Application pending·0 cites
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