Inventor · disambiguated record
Yung-Tai Hung
Also filed as: HUNG YUNG-TAI
19 granted patents·11 pending applications·100 citations·filing 2002–2019
91Inventor score
Top patents by PatentIndex Score
30 records- 0196US8047899B2Pad and method for chemical mechanical polishingMACRONIX INT CO LTD·Filed 2007·Granted Nov 1, 2011·25 cites·5 claims
- 0285US6750117B1Shallow trench isolation processMACRONIX INT CO LTD·Filed 2002·Granted Jun 15, 2004·50 cites·26 claims
- 0384US10388664B2Integrated circuit device with layered trench conductorsMACRONIX INT CO LTD·Filed 2018·Granted Aug 20, 2019·5 cites·17 claims
- 0465US6565705B2Wafer carrier used for chemical mechanic polishingMACRONIX INT CO LTD·Filed 2002·Granted May 20, 2003·10 cites·6 claims
- 0561US7491621B2Method of forming isolation structures in a semiconductor manufacturing processMACRONIX INT CO LTD·Filed 2006·Granted Feb 17, 2009·2 cites·17 claims
- 0661US7361601B2Chemical mechanical polish process and method for improving accuracy of determining polish endpoint thereofMACRONIX INT CO LTD·Filed 2005·Granted Apr 22, 2008·1 cites·21 claims
- 0754US8288280B2Conductor removal processHUNG YUNG-TAI·Filed 2007·Granted Oct 16, 2012·1 cites·10 claims
- 0851US2014120735A1Semiconductor process gas flow control apparatusMACRONIX INT CO LTD·Filed 2012·Application pending·0 cites
- 0950US10892265B2Word line structure and method of manufacturing the sameMACRONIX INT CO LTD·Filed 2019·Granted Jan 12, 2021·0 cites·19 claims
- 1050US9252102B2Semiconductor structure and method for manufacturing the sameMACRONIX INT CO LTD·Filed 2014·Granted Feb 2, 2016·0 cites·12 claims
- 1149US7199018B2Plasma assisted pre-planarization processMACRONIX INT CO LTD·Filed 2004·Granted Apr 3, 2007·2 cites·9 claims
- 1249US6824452B1Polishing pad and process of chemical mechanical use thereofMACRONIX INT CO LTD·Filed 2003·Granted Nov 30, 2004·4 cites·16 claims
- 1348US9070634B1Semiconductor device comprising a surface portion implanted with nitrogen and fluorineMACRONIX INT CO LTD·Filed 2013·Granted Jun 30, 2015·0 cites·21 claims
- 1448US2010244180A1Method for fabricating device isolation structureMACRONIX INT CO LTD·Filed 2009·Application pending·0 cites
- 1547US2012040532A1Pad and method for chemical mechanical polishingCHEN CHUN-FU·Filed 2011·Application pending·0 cites
- 1645US7786023B2Metal pad formation method and metal pad structure using the sameMACRONIX INT CO LTD·Filed 2007·Granted Aug 31, 2010·0 cites·21 claims
- 1745US7544618B2Two-step chemical mechanical polishing processMACRONIX INT CO LTD·Filed 2006·Granted Jun 9, 2009·0 cites·18 claims
- 1842US9431287B2Chemical mechanical planarization process and structuresMACRONIX INT CO LTD·Filed 2012·Granted Aug 30, 2016·0 cites·21 claims
- 1942US2003126909A1System and method for monitoring the slurry specific gravity by using the electrophoretic technologyMACRONIX INT CO LTD·Filed 2002·Application pending·0 cites
- 2039US2006252267A1Topology-selective oxide CMPWANG WAI S·Filed 2005·Application pending·0 cites
- 2138US2018337140A13d integrated circuit device having a buttress structure for resisting deformationMACRONIX INT CO LTD·Filed 2017·Application pending·0 cites
- 2237US9685373B2Conductive plug and method of forming the sameMACRONIX INT CO LTD·Filed 2015·Granted Jun 20, 2017·0 cites·5 claims
- 2337US2011275216A1Two step chemical-mechanical polishing processMACRONIX INT CO LTD·Filed 2010·Application pending·0 cites
- 2435US2005084990A1Endpoint detection in manufacturing semiconductor deviceFiled 2003·Application pending·0 cites
- 2534US8445982B2Method of forming a semiconductor deviceYEH CHIN-TSAN·Filed 2011·Granted May 21, 2013·0 cites·11 claims
- 2634US2007054471A1Alignment mark and method of forming the sameCHEN CHUN-FU·Filed 2005·Application pending·0 cites
- 2731US2013241075A1Contact or via critical dimension control with novel closed loop control system in chemical mechanical planarization processYEH CHIN-TSAN·Filed 2012·Application pending·0 cites
- 2831US2016351493A1Semiconductor device and manufacturing method for the sameMACRONIX INT CO LTD·Filed 2015·Application pending·0 cites
- 2930US9045838B2System and method for semiconductor wafer processing with side/bevel protectionKO MENG TSUNG·Filed 2011·Granted Jun 2, 2015·0 cites·19 claims
- 3028US9117752B2Kink poly structure for improving random single bit failureLUO SHING ANN·Filed 2011·Granted Aug 25, 2015·0 cites·6 claims
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