Inventor · disambiguated record
Seshadri Kolluri
Also filed as: KOLLURI SESHADRI · KOLLURI SESHADRI K
12 granted patents·1 pending application·33 citations·filing 2008–2017
88Inventor score
Top patents by PatentIndex Score
13 records- 0189US9837438B2GaN transistors with polysilicon layers used for creating additional componentsEFFICIENT POWER CONVERSION CORP·Filed 2015·Granted Dec 5, 2017·6 cites·8 claims
- 0289US9214461B2GaN transistors with polysilicon layers for creating additional componentsEFFICIENT POWER CONVERSION CORP·Filed 2014·Granted Dec 15, 2015·9 cites·12 claims
- 0382US10312260B2GaN transistors with polysilicon layers used for creating additional componentsEFFICIENT POWER CONVERSION CORP·Filed 2017·Granted Jun 4, 2019·3 cites·17 claims
- 0482US9171911B2Isolation structure in gallium nitride devices and integrated circuitsEFFICIENT POWER CONVERSION CORP·Filed 2014·Granted Oct 27, 2015·6 cites·26 claims
- 0572US10090274B2Flip chip interconnection with reduced current densityEFFICIENT POWER CONVERSION CORP·Filed 2015·Granted Oct 2, 2018·2 cites·15 claims
- 0665US9583480B2Integrated circuit with matching threshold voltages and method for making sameEFFICIENT POWER CONV CORP·Filed 2015·Granted Feb 28, 2017·1 cites·11 claims
- 0765US9373399B2Resistance variable element methods and apparatusesMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 21, 2016·2 cites·20 claims
- 0862US10242738B2Resistance variable element methods and apparatusesMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 26, 2019·1 cites·23 claims
- 0961US9214399B2Integrated circuit with matching threshold voltages and method for making sameEFFICIENT POWER CONVERSION CORP·Filed 2014·Granted Dec 15, 2015·1 cites·20 claims
- 1060US9842649B2Resistance variable element methods and apparatusesMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 12, 2017·1 cites·11 claims
- 1159US9331191B2GaN device with reduced output capacitance and process for making sameEFFICIENT POWER CONVERSION CORP·Filed 2014·Granted May 3, 2016·1 cites·11 claims
- 1246US9214528B2Method to fabricate self-aligned isolation in gallium nitride devices and integrated circuitsEFFICIENT POWER CONVERSION CORP·Filed 2014·Granted Dec 15, 2015·0 cites·22 claims
- 1345US2009164183A1Methodology for Thermal Modeling of On-Chip Interconnects Based on Electromagnetic Simulation ToolsIBM·Filed 2008·Application pending·0 cites
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