Inventor · disambiguated record
Tamio Matsumura
Also filed as: MATSUMURA TAMIO
8 granted patents·2 pending applications·15 citations·filing 1996–2024
80Inventor score
Top patents by PatentIndex Score
10 records- 0173US9659808B2Semiconductor-element manufacturing method and wafer mounting device using a vacuum end-effectorMITSUBISHI ELECTRIC CORP·Filed 2013·Granted May 23, 2017·3 cites·8 claims
- 0267US8987122B2Method of manufacturing semiconductor deviceNAKATA KAZUNARI·Filed 2012·Granted Mar 24, 2015·2 cites·7 claims
- 0364US10882141B2Substrate suction stage, substrate treatment apparatus, and substrate treatment methodMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jan 5, 2021·1 cites·16 claims
- 0457US2024253158A1Laser processing apparatus and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0552US11389898B2Laser processing apparatus, laser processing method, and method for manufacturing semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 19, 2022·0 cites·14 claims
- 0651US6595428B2Process control device and process control method using a medium with rewritable marking techniqueMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 22, 2003·4 cites·20 claims
- 0745US10134598B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Nov 20, 2018·0 cites·9 claims
- 0842US2022336293A1Inspection device, inspection method of semiconductor substrate, manufacturing method of semiconductor substrate, and manufacturing method of semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0941US8183144B2Method of manufacturing semiconductor deviceMATSUMURA TAMIO·Filed 2006·Granted May 22, 2012·1 cites·12 claims
- 1033US5679204APlasma apparatusSHIKOKU INSTRUMENTATION CO LTD·Filed 1996·Granted Oct 21, 1997·4 cites·9 claims
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