Inventor · disambiguated record
Wen-Liang Tseng
Also filed as: TSENG WEN-LIANG
64 granted patents·47 pending applications·386 citations·filing 1991–2019
98Inventor score
Files withADVANCED OPTOELECTRONIC TECH65HSIEH MIN-TSUN7CHEN LUNG-HSIN5LIN HSIN-CHIANG5IND TECH RES INST3
Top patents by PatentIndex Score
111 records- 0196US9431591B1LED package with reflecting cupADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Aug 30, 2016·8 cites·15 claims
- 0293US7719099B2Package structure for solid-state lighting devices and method of fabricating the sameADVANCED OPTOELECTRONIC TECH·Filed 2006·Granted May 18, 2010·20 cites·22 claims
- 0392US8470621B2Method for fabricating a flip-chip semiconductor optoelectronic deviceKUO CHESTER·Filed 2010·Granted Jun 25, 2013·19 cites·14 claims
- 0488US9543486B1LED package with reflecting cupADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Jan 10, 2017·6 cites·17 claims
- 0587US7994628B2Package structure of photoelectronic device and fabricating method thereofADVANCED OPTOELECTRIC TECHNOLOGY INC·Filed 2008·Granted Aug 9, 2011·14 cites·18 claims
- 0685US5229699AMethod and an apparatus for PID controller tuningIND TECH RES INST·Filed 1991·Granted Jul 20, 1993·122 cites·8 claims
- 0783USD791742SWireless head for microphoneHON HAI PREC IND CO LTD·Filed 2015·Granted Jul 11, 2017·28 cites·1 claims
- 0878US7989237B2Package structure for solid-state lighting devices and method of fabricating the sameADVANCES OPTOELECTRONIC TECHNOLOGY INC·Filed 2008·Granted Aug 2, 2011·8 cites·22 claims
- 0977US8378378B2Light emitting diode package and method of fabricating the sameADVANCED OPTOELECTRONIC TECH·Filed 2010·Granted Feb 19, 2013·4 cites·8 claims
- 1076USD644189SLED light barADVANCED OPTOELECTRONIC TECH·Filed 2010·Granted Aug 30, 2011·22 cites·1 claims
- 1175US6603151B2Method and structure for packaging a high efficiency electro-optics deviceOPTO TECH CORP·Filed 2002·Granted Aug 5, 2003·24 cites·20 claims
- 1273US8772062B2Method for manufacturing light emitting diode package having LED die fixed by anisotropic conductive pasteADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jul 8, 2014·3 cites·14 claims
- 1373US6686218B2Method for packaging a high efficiency electro-optics deviceOPTO TECH CORP·Filed 2003·Granted Feb 3, 2004·20 cites·20 claims
- 1471US8979312B2Light emitting diode bulbADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Mar 17, 2015·3 cites·9 claims
- 1571US8455274B2Method for manufacturing light emitting diodeCHEN PIN-CHUAN·Filed 2011·Granted Jun 4, 2013·3 cites·17 claims
- 1669US9992566B2Wireless joint and wireless microphone having sameHON HAI PREC IND CO LTD·Filed 2016·Granted Jun 5, 2018·2 cites·13 claims
- 1769US8921131B2Method for manufacturing light emitting diode packageCHEN LUNG-HSIN·Filed 2012·Granted Dec 30, 2014·1 cites·20 claims
- 1868US8551794B2LED package and mold of manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Oct 8, 2013·2 cites·12 claims
- 1968US8459838B2Traffic lightLIAO CHI-WEI·Filed 2010·Granted Jun 11, 2013·5 cites·17 claims
- 2068US7031854B2Universal power measurement SoC and measuring methodIND TECH RES INST·Filed 2004·Granted Apr 18, 2006·16 cites·12 claims
- 2167US8242519B2Package structure of light emitting diode for backlightTSANG JIAN SHIHN·Filed 2010·Granted Aug 14, 2012·2 cites·18 claims
- 2265US9012248B2Method for packaging light emitting diodeCHEN LUNG-HSIN·Filed 2012·Granted Apr 21, 2015·2 cites·8 claims
- 2365US8476664B2Light emitting diode package having multiple luminescent conversion layersLIN HSIN-CHIANG·Filed 2011·Granted Jul 2, 2013·2 cites·15 claims
- 2464US10890802B2Optical lens, backlight module and display device using sameADVANCED OPTOELECTRONIC TECH·Filed 2019·Granted Jan 12, 2021·0 cites·14 claims
- 2564US6445008B1Photo sensing device and the manufacturing method thereofOPTO TECH CORP·Filed 2001·Granted Sep 3, 2002·12 cites·34 claims
- 2662US9184358B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Nov 10, 2015·1 cites·12 claims
- 2762US8455275B2Method for making light emitting diode packageHONG MENG-HSIEN·Filed 2011·Granted Jun 4, 2013·2 cites·3 claims
- 2861US8828755B2Light-emitting element package and fabrication method thereofADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Sep 9, 2014·0 cites·9 claims
- 2961US8384276B2LED lamp structureADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Feb 26, 2013·1 cites·7 claims
- 3059USD654444SLED moduleLIN CHIH-YUNG·Filed 2010·Granted Feb 21, 2012·11 cites·1 claims
- 3159US7508007B2Package structure of light-emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2007·Granted Mar 24, 2009·1 cites·12 claims
- 3258US8687796B2Method and electronic device for improving communication quality based on ambient noise sensingSUN TING-WEI·Filed 2010·Granted Apr 1, 2014·1 cites·12 claims
- 3357US8657469B2Traffic light assemblyADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Feb 25, 2014·1 cites·4 claims
- 3457US7855390B2Package structure of light emitting diode for backlightADVANCED OPTOELECTRONIC TECH·Filed 2008·Granted Dec 21, 2010·1 cites·13 claims
- 3554US2015003080A1Light emitting diode moduleADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 3652US9899587B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Feb 20, 2018·0 cites·4 claims
- 3752US9842968B2LED packageADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Dec 12, 2017·0 cites·12 claims
- 3852US8960955B2LED lamp having a large illumination angleADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Feb 24, 2015·0 cites·20 claims
- 3951US2010070064A1Method and system for configuring high cri ledADVANCED OPTOELECTRONIC TECH·Filed 2009·Application pending·0 cites
- 4051US2010090935A1Method and system for configuring high cri ledADVANCED OPTOELECTRONIC TECH·Filed 2009·Application pending·0 cites
- 4150US10133133B1Liquid crystal display baseADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Nov 20, 2018·0 cites·10 claims
- 4250US9746162B2Light emitting diode bulbADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Aug 29, 2017·0 cites·20 claims
- 4350US9620692B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Apr 11, 2017·0 cites·11 claims
- 4450US8956893B2Metiod of making LED with bat-wing emitting field lensADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Feb 17, 2015·0 cites·16 claims
- 4550US2015009680A1Lens and light emitting element using the sameADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 4650US2013248922A1Flip-chip semiconductor optoelectronic device and method for fabricating the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Application pending·0 cites
- 4749US9660144B2LED package and LED dieADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted May 23, 2017·0 cites·13 claims
- 4849US9465205B2Optical lens and backlight module incorporating the sameADVANCED OPTOELECTRONIC TECH·Filed 2014·Granted Oct 11, 2016·0 cites·10 claims
- 4949US8906715B2Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the sameCHEN LUNG-HSIN·Filed 2012·Granted Dec 9, 2014·0 cites·10 claims
- 5049US8541799B2Light-emitting element package and fabrication method thereofHSIEH MIN-TSUN·Filed 2011·Granted Sep 24, 2013·0 cites·7 claims
Showing the top 50 of 111 patent records by PatentIndex Score.
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