Inventor · disambiguated record
Hyeon J. Jeong
Also filed as: JEONG HYEON J · JEONG HYEON JO
7 granted patents·472 citations·filing 1993–1996
89Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0196US5744827AThree dimensional stack package device having exposed coupling lead portions and vertical interconnection elementsSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Apr 28, 1998·312 cites·28 claims
- 0276US5250840ASemiconductor lead frame with a chip having bonding pads in a cross arrangementSAMSUNG ELECTRONICS CO LTD·Filed 1993·Granted Oct 5, 1993·54 cites·8 claims
- 0361US5808354ALead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surfaceSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Sep 15, 1998·31 cites·5 claims
- 0459US5581195ASemiconductor chip holding deviceSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Dec 3, 1996·20 cites·9 claims
- 0557US5349235AHigh density vertically mounted semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 1993·Granted Sep 20, 1994·27 cites·8 claims
- 0646US5468991ALead frame having dummy leadsSAMSUNG ELECTRONICS CO LTD·Filed 1993·Granted Nov 21, 1995·17 cites·5 claims
- 0742US5811875ALead frames including extended tie-bars, and semiconductor chip packages using sameSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Sep 22, 1998·11 cites·13 claims
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