Inventor · disambiguated record
Frank L. Pompeo
Also filed as: POMPEO FRANK L · POMPEO FRANK LOUIS · POMPEO JR FRANK L · POMPEO JR FRANK LOUIS
49 granted patents·3 pending applications·1,483 citations·filing 1994–2021
99Inventor score
Top patents by PatentIndex Score
52 records- 0197US6444496B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 2000·Granted Sep 3, 2002·123 cites·10 claims
- 0295US10842043B1Fabricating coolant-cooled heat sinks with internal thermally-conductive finsIBM·Filed 2019·Granted Nov 17, 2020·22 cites·20 claims
- 0394US11156409B2Coolant-cooled heat sinks with internal thermally-conductive fins joined to the coverIBM·Filed 2020·Granted Oct 26, 2021·6 cites·20 claims
- 0493US5956576AEnhanced protection of semiconductors with dual surface sealIBM·Filed 1996·Granted Sep 21, 1999·142 cites·42 claims
- 0591US7806341B2Structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2009·Granted Oct 5, 2010·16 cites·26 claims
- 0691US7281667B2Method and structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2005·Granted Oct 16, 2007·18 cites·4 claims
- 0790US6275381B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 1998·Granted Aug 14, 2001·65 cites·12 claims
- 0890US5471027AMethod for forming chip carrier with a single protective encapsulantIBM·Filed 1994·Granted Nov 28, 1995·132 cites·17 claims
- 0988US6413353B2Method for direct attachment of a chip to a cooling memberIBM·Filed 1999·Granted Jul 2, 2002·68 cites·15 claims
- 1087US7079393B2Fluidic cooling systems and methods for electronic componentsIBM·Filed 2004·Granted Jul 18, 2006·44 cites·21 claims
- 1187US5533256AMethod for directly joining a chip to a heat sinkIBM·Filed 1995·Granted Jul 9, 1996·102 cites·14 claims
- 1286US5512613ACleavable diepoxide for removable epoxy compositionsIBM·Filed 1994·Granted Apr 30, 1996·77 cites·11 claims
- 1385US7544527B2Method and apparatus for providing optoelectronic communication with an electronic deviceIBM·Filed 2006·Granted Jun 9, 2009·12 cites·3 claims
- 1485US7472836B2Method and structure for implementing secure multichip modules for encryption applicationsIBM·Filed 2007·Granted Jan 6, 2009·11 cites·5 claims
- 1585US5773561APolymer sealants/adhesives and use thereof in electronic package assemblyIBM·Filed 1996·Granted Jun 30, 1998·43 cites·21 claims
- 1685US5659203AReworkable polymer chip encapsulantIBM·Filed 1995·Granted Aug 19, 1997·71 cites·16 claims
- 1782US6518674B2Temporary attach article and method for temporary attach of devices to a substrateIBM·Filed 2001·Granted Feb 11, 2003·23 cites·7 claims
- 1881US5968670AEnhanced ceramic ball grid array using in-situ solder stretch with springIBM·Filed 1997·Granted Oct 19, 1999·63 cites·17 claims
- 1980US9627784B1Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2015·Granted Apr 18, 2017·2 cites·10 claims
- 2079US5881945AMulti-layer solder seal band for semiconductor substrates and processIBM·Filed 1997·Granted Mar 16, 1999·57 cites·26 claims
- 2179US5560934ACleavable diepoxide for removable epoxy compositionsIBM·Filed 1995·Granted Oct 1, 1996·51 cites·29 claims
- 2278US8492199B2Reworkable underfills for ceramic MCM C4 protectionCOFFIN JEFFREY T·Filed 2011·Granted Jul 23, 2013·6 cites·20 claims
- 2378US5881944AMulti-layer solder seal band for semiconductor substratesIBM·Filed 1997·Granted Mar 16, 1999·53 cites·21 claims
- 2475US7245022B2Semiconductor module with improved interposer structure and method for forming the sameIBM·Filed 2003·Granted Jul 17, 2007·17 cites·20 claims
- 2574US5964396AEnhanced ceramic ball grid array using in-situ solder stretch with clipIBM·Filed 1997·Granted Oct 12, 1999·36 cites·15 claims
- 2673US5930597AReworkable polymer chip encapsulantIBM·Filed 1997·Granted Jul 27, 1999·38 cites·6 claims
- 2770US7900809B2Solder interconnection array with optimal mechanical integrityIBM·Filed 2008·Granted Mar 8, 2011·3 cites·13 claims
- 2870US7084496B2Method and apparatus for providing optoelectronic communication with an electronic deviceIBM·Filed 2004·Granted Aug 1, 2006·14 cites·18 claims
- 2968US5975409ACeramic ball grid array using in-situ solder stretchIBM·Filed 1997·Granted Nov 2, 1999·36 cites·5 claims
- 3067US6054008AProcess for adhesively attaching a temporary lid to a microelectronic packageIBM·Filed 1998·Granted Apr 25, 2000·23 cites·7 claims
- 3166US10368441B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2018·Granted Jul 30, 2019·1 cites·20 claims
- 3264US7445141B2Solder interconnection array with optimal mechanical integrityIBM·Filed 2004·Granted Nov 4, 2008·8 cites·19 claims
- 3363US6274214B1Microelectronic package module with temporary lidIBM·Filed 1999·Granted Aug 14, 2001·19 cites·13 claims
- 3463US6111314AThermal cap with embedded particlesIBM·Filed 1998·Granted Aug 29, 2000·23 cites·48 claims
- 3562US6964885B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2004·Granted Nov 15, 2005·9 cites·33 claims
- 3661US11404287B2Fixture facilitating heat sink fabricationIBM·Filed 2020·Granted Aug 2, 2022·0 cites·16 claims
- 3760US12005148B2Coolant-cooled heat sink(s) with associated ultra-violet light assemblyIBM·Filed 2021·Granted Jun 11, 2024·0 cites·17 claims
- 3859US11940271B2High power device fault localization via die surface contouringIBM·Filed 2020·Granted Mar 26, 2024·0 cites·20 claims
- 3959US9974179B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2017·Granted May 15, 2018·0 cites·6 claims
- 4059US6255139B1Method for providing a thermal path through particles embedded in a thermal capIBM·Filed 1999·Granted Jul 3, 2001·19 cites·51 claims
- 4158US6703560B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2001·Granted Mar 9, 2004·7 cites·7 claims
- 4254US10750615B2Method and apparatus for strain relieving surface mount attached connectorsIBM·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 4354US7882623B2Apparatus for removing interconnects to separate two parts of a workpieceIBM·Filed 2008·Granted Feb 8, 2011·0 cites·16 claims
- 4453US7299530B2Ball grid array rework using a continuous belt furnaceIBM·Filed 2003·Granted Nov 27, 2007·4 cites·7 claims
- 4552US7452215B2Ball grid array rework using a continuous belt furnaceIBM·Filed 2007·Granted Nov 18, 2008·0 cites·12 claims
- 4652US7128472B2Method and apparatus for providing optoelectronic communication with an electronic deviceIBM·Filed 2003·Granted Oct 31, 2006·3 cites·15 claims
- 4751US10978313B2Fixture facilitating heat sink fabricationIBM·Filed 2018·Granted Apr 13, 2021·0 cites·15 claims
- 4849US5955543AAryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resinIBM·Filed 1997·Granted Sep 21, 1999·14 cites·18 claims
- 4949US2007252288A1Semiconductor module and method for forming the sameFAROOQ MUKTA G·Filed 2007·Application pending·0 cites
- 5048US2008076690A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2007·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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