Inventor · disambiguated record
Sasha N. Oster
Also filed as: OSTER SASHA · OSTER SASHA N
110 granted patents·24 pending applications·317 citations·filing 2012–2025
99Inventor score
Top patents by PatentIndex Score
134 records- 0197US9915978B2Method of fabricating a stretchable computing deviceINTEL CORP·Filed 2015·Granted Mar 13, 2018·35 cites·5 claims
- 0296US9960849B1Channelization for dispersion limited waveguide communication channelsINTEL CORP·Filed 2016·Granted May 1, 2018·17 cites·19 claims
- 0396US9735893B1Patch system for in-situ therapeutic treatmentINTEL CORP·Filed 2016·Granted Aug 15, 2017·53 cites·20 claims
- 0494US11614532B2Multistatic radar utilizing 5GROCKWELL COLLINS INC·Filed 2020·Granted Mar 28, 2023·4 cites·13 claims
- 0594US11050155B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2016·Granted Jun 29, 2021·7 cites·20 claims
- 0694US10886606B2Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systemsINTEL CORP·Filed 2016·Granted Jan 5, 2021·11 cites·20 claims
- 0794US9902152B2Piezoelectric package-integrated synthetic jet devicesINTEL CORP·Filed 2016·Granted Feb 27, 2018·5 cites·20 claims
- 0893US11562971B2Semiconductor packages with antennasINTEL CORP·Filed 2020·Granted Jan 24, 2023·2 cites·15 claims
- 0993US9505607B2Methods of forming sensor integrated packages and structures formed therebyINTEL CORP·Filed 2015·Granted Nov 29, 2016·8 cites·22 claims
- 1093US9501068B2Integration of pressure sensors into integrated circuit fabrication and packagingINTEL CORP·Filed 2016·Granted Nov 22, 2016·6 cites·20 claims
- 1192US11476554B2Mmwave waveguide to waveguide connectors for automotive applicationsINTEL CORP·Filed 2017·Granted Oct 18, 2022·9 cites·25 claims
- 1292US10079668B2Waveguide communication with increased link data rateINTEL CORP·Filed 2016·Granted Sep 18, 2018·8 cites·24 claims
- 1392US9967040B2Patch system for in-situ therapeutic treatmentINTEL CORP·Filed 2017·Granted May 8, 2018·14 cites·20 claims
- 1491US10804227B2Semiconductor packages with antennasINTEL CORP·Filed 2016·Granted Oct 13, 2020·5 cites·18 claims
- 1591US9260294B2Integration of pressure or inertial sensors into integrated circuit fabrication and packagingLEE KYU OH·Filed 2013·Granted Feb 16, 2016·9 cites·18 claims
- 1690US10686250B1Cup antenna radioROCKWELL COLLINS INC·Filed 2018·Granted Jun 16, 2020·6 cites·20 claims
- 1790US10452571B2Microelectronic package communication using radio interfaces connected through waveguidesINTEL CORP·Filed 2015·Granted Oct 22, 2019·8 cites·16 claims
- 1890US9893438B1Electrical connectors for high density attach to stretchable boardsINTEL CORP·Filed 2016·Granted Feb 13, 2018·7 cites·6 claims
- 1990US8926196B2Method and apparatus for an optical interconnect systemINTEL CORP·Filed 2012·Granted Jan 6, 2015·13 cites·17 claims
- 2090US2025316619A1Semiconductor packages with antennasINTEL CORP·Filed 2025·Application pending·0 cites
- 2188US10039186B2Stretchable and flexible electrical substrate interconnectionsINTEL CORP·Filed 2016·Granted Jul 31, 2018·5 cites·19 claims
- 2287US11056765B2Microelectronic devices designed with foldable flexible substrates for high frequency communication modulesINTEL CORP·Filed 2016·Granted Jul 6, 2021·5 cites·17 claims
- 2386US12362297B2Semiconductor packages with antennasINTEL CORP·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 2485US10215164B2Fabric-based piezoelectric energy harvestingINTEL CORP·Filed 2015·Granted Feb 26, 2019·3 cites·19 claims
- 2585US2024266745A1Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2024·Application pending·0 cites
- 2684US10424559B2Thermal management of molded packagesINTEL CORP·Filed 2016·Granted Sep 24, 2019·5 cites·27 claims
- 2784US2025316617A1Semiconductor packages with antennasINTEL CORP·Filed 2025·Application pending·0 cites
- 2883US12155133B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 2983US11476931B1Electromagnetic (EM) channel emulator systemROCKWELL COLLINS INC·Filed 2021·Granted Oct 18, 2022·2 cites·13 claims
- 3083US9345184B2Magnetic field shielding for packaging build-up architecturesINTEL CORP·Filed 2013·Granted May 17, 2016·6 cites·22 claims
- 3182US11929798B2Technique for post-correlation beamformingROCKWELL COLLINS INC·Filed 2021·Granted Mar 12, 2024·1 cites·9 claims
- 3282US9791470B2Magnet placement for integrated sensor packagesINTEL CORP·Filed 2013·Granted Oct 17, 2017·4 cites·20 claims
- 3381US11887946B2Semiconductor packages with antennasINTEL CORP·Filed 2022·Granted Jan 30, 2024·0 cites·22 claims
- 3481US10263312B2Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boardsINTEL CORP·Filed 2016·Granted Apr 16, 2019·3 cites·22 claims
- 3581US10256521B2Waveguide connector with slot launcherINTEL CORP·Filed 2016·Granted Apr 9, 2019·3 cites·25 claims
- 3680US10594029B2Actuatable and adaptable metamaterials integrated in packageINTEL CORP·Filed 2016·Granted Mar 17, 2020·3 cites·22 claims
- 3780US10461388B2Millimeter wave fabric network over dielectric waveguidesINTEL CORP·Filed 2016·Granted Oct 29, 2019·3 cites·29 claims
- 3879US11223524B2Package integrated security featuresINTEL CORP·Filed 2018·Granted Jan 11, 2022·2 cites·12 claims
- 3979US10992016B2Multiplexer and combiner structures embedded in a mmwave connector interfaceINTEL CORP·Filed 2017·Granted Apr 27, 2021·2 cites·24 claims
- 4079US10211970B2Millimeter wave CMOS engines for waveguide fabricsINTEL CORP·Filed 2017·Granted Feb 19, 2019·3 cites·25 claims
- 4178US11251512B2Pluggable MM-wave module for rack scale architecture (RSA) servers and high performance computers (HPCS)INTEL CORP·Filed 2017·Granted Feb 15, 2022·4 cites·25 claims
- 4278US10852495B2Microelectronic package communication using radio interfaces connected through wiringINTEL CORP·Filed 2015·Granted Dec 1, 2020·2 cites·12 claims
- 4378US9824901B2Complex cavity formation in molded packaging structuresINTEL CORP·Filed 2016·Granted Nov 21, 2017·2 cites·21 claims
- 4476US11016288B2Adaptable displays using piezoelectric actuatorsINTEL CORP·Filed 2016·Granted May 25, 2021·2 cites·25 claims
- 4575US11658418B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 4675US11394094B2Waveguide connector having a curved array of waveguides configured to connect a package to excitation elementsINTEL CORP·Filed 2016·Granted Jul 19, 2022·2 cites·19 claims
- 4775US11309619B2Waveguide coupling systems and methodsINTEL CORP·Filed 2016·Granted Apr 19, 2022·2 cites·29 claims
- 4874US11430751B2Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communicationsINTEL CORP·Filed 2016·Granted Aug 30, 2022·2 cites·23 claims
- 4974US11037892B2Substrate dielectric waveguides in semiconductor packagesINTEL CORP·Filed 2016·Granted Jun 15, 2021·2 cites·25 claims
- 5074US10566672B2Waveguide connector with tapered slot launcherINTEL CORP·Filed 2016·Granted Feb 18, 2020·2 cites·19 claims
Showing the top 50 of 134 patent records by PatentIndex Score.
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