Inventor · disambiguated record
Nobuhiro Naito
Also filed as: NAITO NOBUHIRO
9 granted patents·6 pending applications·6 citations·filing 2006–2021
77Inventor score
Top patents by PatentIndex Score
15 records- 0174US9327500B2Nozzle plate, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2013·Granted May 3, 2016·2 cites·12 claims
- 0272US7593104B2Method for manufacturing optical module, positioning apparatus, evaluation method and evaluation apparatus for evaluating optical moduleSEIKO EPSON CORP·Filed 2006·Granted Sep 22, 2009·3 cites·6 claims
- 0365US8936355B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2013·Granted Jan 20, 2015·1 cites·8 claims
- 0460US12168756B2Viscosity index improver composition and lubricating oil compositionSANYO CHEMICAL IND LTD·Filed 2021·Granted Dec 17, 2024·0 cites·6 claims
- 0560US2023312797A1Viscosity index improving agent and lubricating oil compositionSANYO CHEMICAL IND LTD·Filed 2021·Application pending·0 cites
- 0658US11345151B2Liquid discharge head and liquid discharge apparatusSEIKO EPSON CORP·Filed 2020·Granted May 31, 2022·0 cites·15 claims
- 0756US2010092767A1Bonding method and bonded bodySEIKO EPSON CORP·Filed 2009·Application pending·0 cites
- 0852US12258534B2Viscosity index improver and lubricating oil compositionSANYO CHEMICAL IND LTD·Filed 2021·Granted Mar 25, 2025·0 cites·9 claims
- 0952US11493327B2Liquid layer thickness measurement method, measurement device, film production methodTORAY INDUSTRIES·Filed 2019·Granted Nov 8, 2022·0 cites·2 claims
- 1048US8905523B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2013·Granted Dec 9, 2014·0 cites·4 claims
- 1147US10370215B2Nip roller and method of manufacturing film roll bodyTORAY INDUSTRIES·Filed 2017·Granted Aug 6, 2019·0 cites·7 claims
- 1246US2010206474A1Bonding method and bonded structureSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 1346US2010304157A1Bonding method and bonded structureSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 1446US2010304156A1Bonding method and bonded structureSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 1543US2010092788A1Bonding method and bonded bodySEIKO EPSON CORP·Filed 2009·Application pending·0 cites
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