Inventor · disambiguated record
David Chai Yih Ming
Also filed as: MING DAVID CHAI YIH
2 granted patents·19 citations·filing 2003–2004
59Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC2
Top patents by PatentIndex Score
2 records- 0171US7057281B2Microelectronic component assemblies employing lead frames having reduced-thickness inner lengthsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 6, 2006·17 cites·56 claims
- 0244US7425470B2Microelectronic component assemblies employing lead frames having reduced-thickness inner lengthsMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 16, 2008·2 cites·15 claims
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