Inventor
TAI LI-CHENG
TW8 patents
⚠️ This page may combine multiple inventors who share the name “TAI LI-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
5 patentsUS7651937B2Jan 26, 2010
Bumping process and structure thereof
ADVANCED SEMICONDUCTOR ENG9 citations81
US7727818B2Jun 1, 2010
Substrate process for an embedded component
ADVANCED SEMICONDUCTOR ENG14 citations80
US7518241B2Apr 14, 2009
Wafer structure with a multi-layer barrier in an UBM layer network device with power supply
ADVANCED SEMICONDUCTOR ENG7 citations69
US7816252B2Oct 19, 2010
Method for forming bumps on under bump metallurgy
ADVANCED SEMICONDUCTOR ENG3 citations58
US7541273B2Jun 2, 2009
Method for forming bumps
ADVANCED SEMICONDUCTOR ENG0 citations48