Inventor · disambiguated record
Randy L. German
Also filed as: GERMAN RANDY L
3 granted patents·373 citations·filing 1991–1994
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0191US5508228ACompliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming sameMICROELECTRONICS & COMPUTER·Filed 1994·Granted Apr 16, 1996·211 cites·37 claims
- 0286US5116463ADetecting completion of electroless via fillMICROELECTRONCS AND COMPUTER T·Filed 1991·Granted May 26, 1992·121 cites·37 claims
- 0367US5830533ASelective patterning of metallization on a dielectric substrateMICROELECTRONICS & COMPUTER·Filed 1992·Granted Nov 3, 1998·41 cites·27 claims
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