Inventor · disambiguated record
James C. Matayabas, Jr.
Also filed as: MATAYABAS JAMES · MATAYABAS JAMES C · MATAYABAS JAMES C JR · MATAYABAS JAMES CHRISTOPHER
74 granted patents·16 pending applications·1,759 citations·filing 1994–2020
99Inventor score
Files withINTEL CORP45EASTMAN CHEM CO18UNIV SOUTH CAROLINA RES FOUND7AMCOL INTERNATIONAL CORP3MATAYABAS JR JAMES C3
Top patents by PatentIndex Score
90 records- 0199US7465605B2In-situ functionalization of carbon nanotubesINTEL CORP·Filed 2005·Granted Dec 16, 2008·66 cites·12 claims
- 0298US7700943B2In-situ functionalization of carbon nanotubesINTEL CORP·Filed 2008·Granted Apr 20, 2010·70 cites·19 claims
- 0397US6084019AHigh I.V. polyester compositions containing platelet particlesEASTMAN CHEMICAL CORP·Filed 1997·Granted Jul 4, 2000·171 cites·23 claims
- 0497US6034163APolyester nanocomposites for high barrier applicationsEASTMAN CHEM CO·Filed 1997·Granted Mar 7, 2000·155 cites·22 claims
- 0596US6384121B1Polymeter/clay nanocomposite comprising a functionalized polymer or oligomer and a process for preparing sameEASTMAN CHEM CO·Filed 1999·Granted May 7, 2002·100 cites·55 claims
- 0695US6777479B1Polyamide nanocomposites with oxygen scavenging capabilityEASTMAN CHEM CO·Filed 2000·Granted Aug 17, 2004·65 cites·17 claims
- 0794US6417262B1High barrier amorphous polyamide-clay nanocomposite and a process for preparing sameEASTMAN CHEM CO·Filed 1999·Granted Jul 9, 2002·79 cites·64 claims
- 0894US6387996B1Polymer/clay intercalates, exfoliates; and nanocomposites having improved gas permeability comprising a clay material with a mixture of two or more organic cations and a process for preparing sameAMCOL INTERNATIONAL CORP·Filed 1999·Granted May 14, 2002·72 cites·30 claims
- 0993US9070660B2Polymer thermal interface material having enhanced thermal conductivityINTEL CORP·Filed 2013·Granted Jun 30, 2015·16 cites·26 claims
- 1093US6653388B1Polymer/clay nanocomposite comprising a clay mixture and a process for making sameUNIV SOUTH CAROLINA RES FOUND·Filed 1999·Granted Nov 25, 2003·52 cites·39 claims
- 1193US6597575B1Electronic packages having good reliability comprising low modulus thermal interface materialsINTEL CORP·Filed 2002·Granted Jul 22, 2003·90 cites·20 claims
- 1293US6548587B1Polyamide composition comprising a layered clay material modified with an alkoxylated onium compoundUNIV SOUTH CAROLINA RES FOUND·Filed 2000·Granted Apr 15, 2003·45 cites·23 claims
- 1393US6376591B1High barrier amorphous polyamide-clay intercalates, exfoliates, and nanocomposite and a process for preparing sameAMCOL INTERNATIONAL CORP·Filed 1999·Granted Apr 23, 2002·66 cites·40 claims
- 1491US8920919B2Thermal interface material composition including polymeric matrix and carbon fillerARORA HITESH·Filed 2012·Granted Dec 30, 2014·10 cites·22 claims
- 1591US7666768B2Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductanceINTEL CORP·Filed 2006·Granted Feb 23, 2010·23 cites·8 claims
- 1690US7019971B2Thermal management systems for micro-componentsINTEL CORP·Filed 2003·Granted Mar 28, 2006·53 cites·15 claims
- 1790US6713547B2Process for preparing high barrier nanocompositesUNIV SOUTH CAROLINA RES FOUND·Filed 2002·Granted Mar 30, 2004·27 cites·20 claims
- 1890US6486253B1Polymer/clay nanocomposite having improved gas barrier comprising a clay material with a mixture of two or more organic cations and a process for preparing sameUNIV SOUTH CAROLINA RES FOUND·Filed 1999·Granted Nov 26, 2002·68 cites·42 claims
- 1990US6071988APolyester composite material and method for its manufacturingEASTMAN CHEM CO·Filed 1997·Granted Jun 6, 2000·54 cites·28 claims
- 2089US10580717B2Multiple-chip package with multiple thermal interface materialsINTEL CORP·Filed 2016·Granted Mar 3, 2020·11 cites·19 claims
- 2189US6552113B2Polymer-clay nanocomposite comprising an amorphous oligomerUNIV SOUTH CAROLINA RES FOUND·Filed 2000·Granted Apr 22, 2003·32 cites·30 claims
- 2289US6391449B1Polymer/clay intercalates, exfoliates, and nanocomposites comprising a clay mixture and a process for making sameAMCOL INTERNATIONAL CORP·Filed 1999·Granted May 21, 2002·49 cites·26 claims
- 2387US6552114B2Process for preparing a high barrier amorphous polyamide-clay nanocompositeUNIV SOUTH CAROLINA RES FOUND·Filed 2002·Granted Apr 22, 2003·25 cites·19 claims
- 2487US6486254B1Colorant composition, a polymer nanocomposite comprising the colorant composition and articles produced therefromUNIV SOUTH CAROLINA RES FOUND·Filed 1999·Granted Nov 26, 2002·43 cites·55 claims
- 2584US9831206B2LPS solder paste based low cost fine pitch pop interconnect solutionsINTEL CORP·Filed 2014·Granted Nov 28, 2017·5 cites·8 claims
- 2684US7723160B2Thermal interface structure with integrated liquid cooling and methodsINTEL CORP·Filed 2006·Granted May 25, 2010·9 cites·17 claims
- 2783US7671120B2Chain extension for thermal materialsINTEL CORP·Filed 2006·Granted Mar 2, 2010·4 cites·16 claims
- 2883US7327027B2Thermal interface structure with integrated liquid cooling and methodsINTEL CORP·Filed 2006·Granted Feb 5, 2008·8 cites·24 claims
- 2983US7030485B2Thermal interface structure with integrated liquid cooling and methodsINTEL CORP·Filed 2003·Granted Apr 18, 2006·26 cites·9 claims
- 3082US6924027B2Phase change thermal interface materials including exfoliated clayINTEL CORP·Filed 2003·Granted Aug 2, 2005·24 cites·28 claims
- 3181US7794623B2Microelectronic device having liquid crystalline epoxy resinsINTEL CORP·Filed 2008·Granted Sep 14, 2010·6 cites·10 claims
- 3281US6974723B2Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materialsINTEL CORP·Filed 2004·Granted Dec 13, 2005·25 cites·3 claims
- 3380US7060747B2Chain extension for thermal materialsINTEL CORP·Filed 2001·Granted Jun 13, 2006·12 cites·25 claims
- 3480US6841867B2Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materialsINTEL CORP·Filed 2002·Granted Jan 11, 2005·24 cites·19 claims
- 3579US10586779B2LPS solder paste based low cost fine pitch pop interconnect solutionsINTEL CORP·Filed 2017·Granted Mar 10, 2020·1 cites·13 claims
- 3679US10056314B2Polymer thermal interface material having enhanced thermal conductivityINTEL CORP·Filed 2015·Granted Aug 21, 2018·3 cites·13 claims
- 3775US7179689B2Package stress managementINTEL CORP·Filed 2005·Granted Feb 20, 2007·6 cites·13 claims
- 3874US6469379B1Chain extension for thermal materialsINTEL CORP·Filed 2001·Granted Oct 22, 2002·21 cites·12 claims
- 3969US11404349B2Multi-chip packages and sinterable paste for use with thermal interface materialsINTEL CORP·Filed 2016·Granted Aug 2, 2022·2 cites·11 claims
- 4069US8900919B2Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materialsINTEL CORP·Filed 2013·Granted Dec 2, 2014·2 cites·19 claims
- 4166US8431673B2Radiation curable compositionsWANG ZHIKAI JEFFREY·Filed 2008·Granted Apr 30, 2013·3 cites·15 claims
- 4265US9631065B2Methods of forming wafer level underfill materials and structures formed therebyINTEL CORP·Filed 2013·Granted Apr 25, 2017·1 cites·42 claims
- 4365US7170188B2Package stress managementINTEL CORP·Filed 2004·Granted Jan 30, 2007·11 cites·14 claims
- 4465US5393867APolyether polymers derived from 3,4-epxoy-1-buteneEASTMAN CHEM CO·Filed 1994·Granted Feb 28, 1995·13 cites·11 claims
- 4563US7408787B2Phase change thermal interface materials including polyester resinINTEL CORP·Filed 2003·Granted Aug 5, 2008·10 cites·18 claims
- 4661US7030483B2Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package applicationINTEL CORP·Filed 2003·Granted Apr 18, 2006·9 cites·20 claims
- 4761US5434314APolyether glycols and alcohols derived from 3,4-epoxy-1-buteneEASTMAN CHEM CO·Filed 1994·Granted Jul 18, 1995·10 cites·4 claims
- 4859US5608034APolyether polymers derived from 3,4-epoxy-1-buteneEASTMAN CHEM CO·Filed 1995·Granted Mar 4, 1997·13 cites·4 claims
- 4958US6974728B2Encapsulant mixture having a polymer bound catalystINTEL CORP·Filed 2003·Granted Dec 13, 2005·7 cites·16 claims
- 5057US6486252B1Nanocomposites for high barrier applicationsEASTMAN CHEM CO·Filed 1999·Granted Nov 26, 2002·14 cites·18 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
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