Inventor · disambiguated record
Yumi Maruyama
Also filed as: MARUYAMA YUMI
3 granted patents·6 pending applications·23 citations·filing 2006–2025
63Inventor score
Files withDENSO CORP9
Top patents by PatentIndex Score
9 records- 0189US7901967B2Dicing method for semiconductor substrateDENSO CORP·Filed 2006·Granted Mar 8, 2011·20 cites·21 claims
- 0271US2025387862A1Tool abnormality detection systemDENSO CORP·Filed 2025·Application pending·0 cites
- 0366US2025313415A1Conveyance systemDENSO CORP·Filed 2025·Application pending·0 cites
- 0465US9029960B2Semiconductor device and method of manufacturing the sameDENSO CORP·Filed 2013·Granted May 12, 2015·3 cites·5 claims
- 0541US2007111477A1Semiconductor waferDENSO CORP·Filed 2006·Application pending·0 cites
- 0640US7838396B2Bonding method of semiconductor substrate and sheet, and manufacturing method of semiconductor chips using the sameDENSO CORP·Filed 2006·Granted Nov 23, 2010·0 cites·19 claims
- 0740US2007232107A1Cap attachment structure, semiconductor sensor device and methodDENSO CORP·Filed 2007·Application pending·0 cites
- 0840US2007111480A1Wafer product and processing method thereforDENSO CORP·Filed 2006·Application pending·0 cites
- 0937US2019064509A1Variable focus mirror and optical scanning deviceDENSO CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →