Inventor · disambiguated record
In-Sun Park
Also filed as: PARK IN-SUN
47 granted patents·20 pending applications·269 citations·filing 1997–2022
98Inventor score
Top patents by PatentIndex Score
67 records- 0191US8192592B2Methods of forming a phase-change material layer including tellurium and methods of manufacturing a phase-change memory device using the sameKIM DO-HYUNG·Filed 2008·Granted Jun 5, 2012·12 cites·20 claims
- 0289US8664633B2Non-volatile memory devices having resistance changeable elements and related systems and methodsPARK HEUNG-KYU·Filed 2011·Granted Mar 4, 2014·17 cites·20 claims
- 0387US8547747B2Non-volatile memory deviceKIM SU-KYOUNG·Filed 2011·Granted Oct 1, 2013·12 cites·19 claims
- 0484US11820859B2Infrared absorbing polymer, infrared absorbing/blocking film, photoelectric device, organic sensor, and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 21, 2023·1 cites·19 claims
- 0583US7504725B2Semiconductor memory device having low-resistance tungsten line and method of manufacturing the semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 17, 2009·30 cites·27 claims
- 0679US8476763B2Semiconductor device conductive pattern structures including dummy conductive patternsKIM HEI-SEUNG·Filed 2011·Granted Jul 2, 2013·5 cites·8 claims
- 0777US7364967B2Methods of forming storage capacitors for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 29, 2008·6 cites·10 claims
- 0876US9355851B2Semiconductor devices and methods of manufacturing the sameHONG JONG-WON·Filed 2012·Granted May 31, 2016·3 cites·12 claims
- 0975US7812332B2Phase change memory device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 12, 2010·7 cites·20 claims
- 1075US5879982AMethods of forming integrated circuit memory devices having improved electrical interconnects thereinSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Mar 9, 1999·38 cites·9 claims
- 1174US8889543B2Method of fabricating semiconductor deviceBAEK JONG-MIN·Filed 2013·Granted Nov 18, 2014·4 cites·20 claims
- 1274US7375025B2Method for forming a metal silicide layer in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 20, 2008·4 cites·9 claims
- 1374US6623798B2Chemical vapor deposition method for depositing silicide and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 23, 2003·13 cites·14 claims
- 1471US7479434B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 20, 2009·5 cites·20 claims
- 1570US7524724B2Method of forming titanium nitride layer and method of fabricating capacitor using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 28, 2009·4 cites·39 claims
- 1670US6964922B2Methods for forming metal interconnections for semiconductor devices having multiple metal depositionsSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 15, 2005·13 cites·26 claims
- 1766US9548466B2Method of forming a thin film and an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 17, 2017·1 cites·18 claims
- 1866US7723182B2Storage electrode of a capacitor and a method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 25, 2010·3 cites·15 claims
- 1965US10263205B2Organic solar cell and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 16, 2019·1 cites·16 claims
- 2065US7566667B2Methods of fabricating a semiconductor device having a barrier metal layer and devices formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 28, 2009·2 cites·30 claims
- 2164US6673718B1Methods for forming aluminum metal wiringsSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 6, 2004·12 cites·46 claims
- 2260US8232638B2Interconnection structure having oxygen trap pattern in semiconductor deviceMA YOUNG-TAE·Filed 2008·Granted Jul 31, 2012·4 cites·17 claims
- 2360US6797575B2Method for forming a polycide structure in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 28, 2004·8 cites·10 claims
- 2460US6740587B2Semiconductor device having a metal silicide layer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 25, 2004·6 cites·24 claims
- 2559US6747354B2Semiconductor devices having multilevel interconnections and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 8, 2004·8 cites·34 claims
- 2658US6905960B2Method of forming a contact in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 14, 2005·9 cites·13 claims
- 2758US6844627B2Metal film semiconductor device and a method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 18, 2005·7 cites·25 claims
- 2857US11777048B2Sensors and electronic devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·39 claims
- 2956US6670268B2Metal interconnection with low resistance in a semiconductor device and a method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 30, 2003·6 cites·31 claims
- 3055US6451691B2Methods of manufacturing a metal pattern of a semiconductor device which include forming nitride layer at exposed sidewalls of Ti layer of the patternSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 17, 2002·7 cites·18 claims
- 3154US8138490B2Variable resistance non-volatile memory cells and methods of fabricating sameOH GYU-HWAN·Filed 2010·Granted Mar 20, 2012·1 cites·20 claims
- 3254US6806135B2Method of manufacturing a semiconductor device using a two-step deposition processSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 19, 2004·5 cites·17 claims
- 3353US6774029B2Method for forming a conductive film and a conductive pattern of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 10, 2004·4 cites·24 claims
- 3452US12120951B2Infrared absorbers, infrared absorbing/blocking films and photoelectric devices and organic sensors and electronic devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 15, 2024·0 cites·33 claims
- 3552US9754826B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 5, 2017·0 cites·8 claims
- 3649US9276214B2Composition for organic thin film, organic thin film, and electronic device including the organic thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 1, 2016·0 cites·9 claims
- 3748US2008185624A1Storage capacitors for semiconductor devicesSAMSUG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3847US8709937B2Method of forming micropattern, method of forming damascene metallization, and semiconductor device and semiconductor memory device fabricated using the samePARK IN-SUN·Filed 2012·Granted Apr 29, 2014·0 cites·22 claims
- 3947US7759159B2Variable resistance non-volatile memory cells and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·1 cites·28 claims
- 4047US6950339B2Circuit for generating trim bit signal in a flash memory deviceHYNIX SEMICONDUCTOR INC·Filed 2003·Granted Sep 27, 2005·5 cites·12 claims
- 4147US2014210055A1Method of forming micropattern, method of forming damascene metallization, and semiconductor device and semiconductor memory device fabricated using the samePARK IN-SUN·Filed 2014·Application pending·0 cites
- 4247US2007074522A1Cryogenic refrigerator including separating deviceLS CABLE LTD·Filed 2006·Application pending·0 cites
- 4347US2024363244A1Method and device for predicting stenosis of dialysis access by using convolutional neural networkUIF UNIV INDUSTRY FOUNDATION YONSEI UNIV·Filed 2022·Application pending·0 cites
- 4447US2006145269A1Semiconductor device having a capping layer including cobalt and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4546US7135407B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 14, 2006·3 cites·18 claims
- 4646US7005373B2Method for forming a metal silicide layer in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 28, 2006·1 cites·10 claims
- 4746US6797618B2Method for forming silicide film of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 28, 2004·1 cites·14 claims
- 4846US2007272950A1Semiconductor memory devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4945US7122468B2Methods of fabricating integrated circuit conductive contact structures including groovesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 17, 2006·0 cites·10 claims
- 5045US2008003815A1Method of forming a barrier metal layer of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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