Inventor · disambiguated record
Denis Morrissey
Also filed as: MORRISSEY DENIS · MORRISSEY DENIS M
10 granted patents·3 pending applications·309 citations·filing 1985–2013
91Inventor score
Top patents by PatentIndex Score
13 records- 0196US6610192B1Copper electroplatingSHIPLEY CO LLC·Filed 2001·Granted Aug 26, 2003·113 cites·14 claims
- 0289US4683036AMethod for electroplating non-metallic surfacesKOLLMORGEN TECH CORP·Filed 1985·Granted Jul 28, 1987·56 cites·37 claims
- 0387US6679983B2Method of electrodepositing copperSHIPLEY CO LLC·Filed 2001·Granted Jan 20, 2004·23 cites·14 claims
- 0485US6531046B2Seed layer repair methodSHIPLEY CO LLC·Filed 2000·Granted Mar 11, 2003·44 cites·20 claims
- 0574US6508924B1Control of breakdown products in electroplating bathsSHIPLEY CO LLC·Filed 2000·Granted Jan 21, 2003·22 cites·11 claims
- 0671US6797146B2Seed layer repairSHIPLEY CO LLC·Filed 2001·Granted Sep 28, 2004·14 cites·18 claims
- 0771US6660153B2Seed layer repair bathSHIPLEY CO LLC·Filed 2001·Granted Dec 9, 2003·15 cites·15 claims
- 0869US6649038B2Electroplating methodSHIPLEY CO LLC·Filed 2001·Granted Nov 18, 2003·13 cites·20 claims
- 0963US6660154B2Seed layerSHIPLEY CO LLC·Filed 2001·Granted Dec 9, 2003·9 cites·18 claims
- 1041US9202946B2Methods for metallizing an aluminum pasteBELLEMARE RICHARD·Filed 2013·Granted Dec 1, 2015·0 cites·23 claims
- 1135US2002090484A1Plating bathSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 1235US2002134684A1Seed layer processesSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 1334US2002074242A1Seed layer recoverySHIPLEY CO LLC·Filed 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →