Inventor · disambiguated record
Lynne A. Okada
Also filed as: OKADA LYNNE · OKADA LYNNE A
37 granted patents·1 pending application·804 citations·filing 2000–2005
98Inventor score
Files withADVANCED MICRO DEVICES INC38
Top patents by PatentIndex Score
38 records- 0192US6583046B1Post-treatment of low-k dielectric for prevention of photoresist poisoningADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 24, 2003·67 cites·26 claims
- 0292US6475929B1Method of manufacturing a semiconductor structure with treatment to sacrificial stop layer producing diffusion to an adjacent low-k dielectric layer lowering the constantADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 5, 2002·70 cites·18 claims
- 0389US6534397B1Pre-treatment of low-k dielectric for prevention of photoresist poisoningADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 18, 2003·56 cites·21 claims
- 0489US6309955B1Method for using a CVD organic barc as a hard mask during via etchADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 30, 2001·54 cites·10 claims
- 0587US6599839B1Plasma etch process for nonhomogenous filmADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 29, 2003·36 cites·10 claims
- 0687US6472231B1Dielectric layer with treated top surface forming an etch stop layer and method of making the sameADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 29, 2002·43 cites·17 claims
- 0784US6521524B1Via filled dual damascene structure with middle stop layer and method for making the sameADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 18, 2003·36 cites·15 claims
- 0883US6872663B1Method for reworking a multi-layer photoresist following an underlayer developmentADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 29, 2005·28 cites·16 claims
- 0982US6514860B1Integration of organic fill for dual damascene processADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 4, 2003·34 cites·20 claims
- 1082US6465889B1Silicon carbide barc in dual damascene processingADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 15, 2002·32 cites·20 claims
- 1181US6713382B1Vapor treatment for repairing damage of low-k dielectricADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 30, 2004·37 cites·10 claims
- 1280US6372631B1Method of making a via filled dual damascene structure without middle stop layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 16, 2002·29 cites·17 claims
- 1378US7256499B1Ultra low dielectric constant integrated circuit systemADVANCED MICRO DEVICES INC·Filed 2005·Granted Aug 14, 2007·8 cites·20 claims
- 1477US6451673B1Carrier gas modification for preservation of mask layer during plasma etchingADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 17, 2002·20 cites·20 claims
- 1576US6767827B1Method for forming dual inlaid structures for IC interconnectionsADVANCED MICRO DEVICES INC·Filed 2003·Granted Jul 27, 2004·23 cites·29 claims
- 1675US6383919B1Method of making a dual damascene structure without middle stop layerADVANCED MICRO DEVICES INC·Filed 2001·Granted May 7, 2002·18 cites·17 claims
- 1773US6603206B2Slot via filled dual damascene interconnect structure without middle etch stop layerADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 5, 2003·17 cites·5 claims
- 1872US6660619B1Dual damascene metal interconnect structure with dielectric studsADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 9, 2003·18 cites·13 claims
- 1972US6492272B1Carrier gas modification for use in plasma ashing of photoresistADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 10, 2002·15 cites·20 claims
- 2071US6448654B1Ultra thin etch stop layer for damascene processADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 10, 2002·16 cites·12 claims
- 2170US6699792B1Polymer spacers for creating small geometry space and method of manufacture thereofADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 2, 2004·13 cites·3 claims
- 2269US6632707B1Method for forming an interconnect structure using a CVD organic BARC to mitigate via poisoningADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 14, 2003·15 cites·8 claims
- 2367US7208418B1Sealing sidewall pores in low-k dielectricsADVANCED MICRO DEVICES INC·Filed 2003·Granted Apr 24, 2007·13 cites·9 claims
- 2467US6495447B1Use of hydrogen doping for protection of low-k dielectric layersADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 17, 2002·13 cites·11 claims
- 2565US6372635B1Method for making a slot via filled dual damascene low k interconnect structure without middle stop layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 16, 2002·11 cites·17 claims
- 2664US6656830B1Dual damascene with silicon carbide middle etch stop layer/ARCADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 2, 2003·12 cites·10 claims
- 2764US6429116B1Method of fabricating a slot dual damascene structure without middle stop layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Aug 6, 2002·12 cites·17 claims
- 2863US6465340B1Via filled dual damascene structure with middle stop layer and method for making the sameADVANCED MICRO DEVICES INC·Filed 2001·Granted Oct 15, 2002·11 cites·6 claims
- 2961US6846749B1N-containing plasma etch process with reduced resist poisoningADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 25, 2005·7 cites·10 claims
- 3058US6444573B1Method of making a slot via filled dual damascene structure with a middle stop layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 3, 2002·8 cites·3 claims
- 3155US6756300B1Method for forming dual damascene interconnect structureADVANCED MICRO DEVICES INC·Filed 2002·Granted Jun 29, 2004·6 cites·15 claims
- 3255US6610608B1Plasma etching using combination of CHF3 and CH3FADVANCED MICRO DEVICES INC·Filed 2001·Granted Aug 26, 2003·4 cites·13 claims
- 3355US6340395B1Salsa clean processADVANCED MICRO DEVICES INC·Filed 2000·Granted Jan 22, 2002·8 cites·6 claims
- 3454US6365505B1Method of making a slot via filled dual damascene structure with middle stop layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 2, 2002·6 cites·15 claims
- 3550US7001840B1Interconnect with multiple layers of conductive material with grain boundary between the layersADVANCED MICRO DEVICES INC·Filed 2003·Granted Feb 21, 2006·2 cites·14 claims
- 3649US7279410B1Method for forming inlaid structures for IC interconnectionsADVANCED MICRO DEVICES INC·Filed 2003·Granted Oct 9, 2007·3 cites·12 claims
- 3749US6391766B1Method of making a slot via filled dual damascene structure with middle stop layerADVANCED MICRO DEVICES INC·Filed 2001·Granted May 21, 2002·3 cites·15 claims
- 3837US2004232552A1Air gap dual damascene process and structureADVANCED MICRO DEVICES INC·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →