Inventor · disambiguated record
Shyh-Ming Chang
Also filed as: CHANG SHYH-MING
33 granted patents·5 pending applications·1,319 citations·filing 1991–2011
98Inventor score
Files withIND TECH RES INST27TAIWAN TFT LCD ASS8CHANG SHYH-MING1INSTR TECHNOLOGY RES CT1YANG SHENG-SHU1
Top patents by PatentIndex Score
38 records- 0196US7300865B2Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesiveIND TECH RES INST·Filed 2005·Granted Nov 27, 2007·53 cites·10 claims
- 0296US5431328AComposite bump flip chip bondingIND TECH RES INST·Filed 1994·Granted Jul 11, 1995·217 cites·12 claims
- 0393US6919642B2Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formedIND TECH RES INST·Filed 2002·Granted Jul 19, 2005·66 cites·13 claims
- 0492US6972490B2Bonding structure with compliant bumpsIND TECH RES INST·Filed 2004·Granted Dec 6, 2005·65 cites·23 claims
- 0592US5707902AComposite bump structure and methods of fabricationIND TECH RES INST·Filed 1995·Granted Jan 13, 1998·120 cites·27 claims
- 0691US6249051B1Composite bump flip chip bondingIND TECH RES INST·Filed 1995·Granted Jun 19, 2001·86 cites·4 claims
- 0791US6084301AComposite bump structuresIND TECH RES INST·Filed 1997·Granted Jul 4, 2000·101 cites·21 claims
- 0891US5749997AComposite bump tape automated bonding method and bonded structureIND TECH RES INST·Filed 1995·Granted May 12, 1998·95 cites·19 claims
- 0988US5578527AConnection construction and method of manufacturing the sameIND TECH RES INST·Filed 1995·Granted Nov 26, 1996·107 cites·17 claims
- 1085US7988808B2Bonding structure with buffer layer and method of forming the sameIND TECH RES INST·Filed 2008·Granted Aug 2, 2011·11 cites·6 claims
- 1185US7834453B2Contact structure having a compliant bump and a test padTAIWAN TFT LCD ASS·Filed 2007·Granted Nov 16, 2010·11 cites·13 claims
- 1284US5393697AComposite bump structure and methods of fabricationIND TECH RES INST·Filed 1994·Granted Feb 28, 1995·91 cites·22 claims
- 1383US7576430B2Bonding structureTAIWAN TFT LCD ASS·Filed 2007·Granted Aug 18, 2009·10 cites·11 claims
- 1482US6537854B1Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formedIND TECH RES INST·Filed 1999·Granted Mar 25, 2003·69 cites·23 claims
- 1581US7449716B2Bond quality indication by bump structure on substrateTAIWAN TFT LCD ASS·Filed 2007·Granted Nov 11, 2008·11 cites·21 claims
- 1681US6767818B1Method for forming electrically conductive bumps and devices formedIND TECH RES INST·Filed 2000·Granted Jul 27, 2004·34 cites·16 claims
- 1780US6605491B1Method for bonding IC chips to substrates with non-conductive adhesiveIND TECH RES INST·Filed 2002·Granted Aug 12, 2003·30 cites·12 claims
- 1878US7977788B2Contact structure having a compliant bump and a testing areaTAIWAN TFT LCD ASS·Filed 2006·Granted Jul 12, 2011·8 cites·15 claims
- 1971US6365500B1Composite bump bondingIND TECH RES INST·Filed 1995·Granted Apr 2, 2002·40 cites·20 claims
- 2067US7531900B2Package structure for electronic deviceIND TECH RES INST·Filed 2006·Granted May 12, 2009·3 cites·13 claims
- 2167US5861661AComposite bump tape automated bonded structureIND TECH RES INST·Filed 1997·Granted Jan 19, 1999·36 cites·10 claims
- 2266US7154176B2Conductive bumps with non-conductive juxtaposed sidewallsIND TECH RES INST·Filed 2003·Granted Dec 26, 2006·13 cites·27 claims
- 2365US7871918B2Manufacturing method of contact structureTAIWAN TFT LCD ASS·Filed 2009·Granted Jan 18, 2011·2 cites·11 claims
- 2465US7183494B2Bonding structure with buffer layer and method of forming the sameIND TECH RES INST·Filed 2004·Granted Feb 27, 2007·3 cites·14 claims
- 2563US7459055B2Bonding structure with buffer layer and method of forming the sameIND TECH RES INST·Filed 2006·Granted Dec 2, 2008·2 cites·9 claims
- 2661US7348271B2Method for fabricating conductive bumps with non-conductive juxtaposed sidewallsIND TECH RES INST·Filed 2006·Granted Mar 25, 2008·2 cites·12 claims
- 2750US8211788B2Method of fabricating bonding structureCHANG SHYH-MING·Filed 2009·Granted Jul 3, 2012·0 cites·8 claims
- 2848US7446421B2Bonding structure with buffer layer and method of forming the sameIND TECH RES INST·Filed 2007·Granted Nov 4, 2008·0 cites·20 claims
- 2947US6024274AMethod for tape automated bonding to composite bumpsIND TECH RES INST·Filed 1996·Granted Feb 15, 2000·15 cites·11 claims
- 3047US2009243093A1Contact structure and connecting structureTAIWAN TFT LCD ASS·Filed 2009·Application pending·0 cites
- 3146US5127573ATape automated bonding apparatus with automatic leveling stageIND TECH RES INST·Filed 1991·Granted Jul 7, 1992·18 cites·17 claims
- 3246US2008284011A1Bump structureTAIWAN TFT LCD ASS·Filed 2007·Application pending·0 cites
- 3345US7378746B2Composite bumpIND TECH RES INST·Filed 2006·Granted May 27, 2008·0 cites·17 claims
- 3445US2011230044A1Contact structure having a compliant bump and a testing area and manufacturing method for the sameTAIWAN TFT LCD ASS·Filed 2011·Application pending·0 cites
- 3545US2008237850A1Compliant bump structure and bonding structureIND TECH RES INST·Filed 2007·Application pending·0 cites
- 3643US7732928B2Structure for protecting electronic packaging contacts from stressINSTR TECHNOLOGY RES CT·Filed 2006·Granted Jun 8, 2010·0 cites·17 claims
- 3740US8215969B2Contact structure and forming method thereof and connecting structure thereofYANG SHENG-SHU·Filed 2008·Granted Jul 10, 2012·0 cites·42 claims
- 3839US2002070463A1Composite bump bondingIND TECH RES INST·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →