Inventor · disambiguated record
Masahiro Tadauchi
Also filed as: TADAUCHI MASAHIRO
10 granted patents·5 pending applications·480 citations·filing 1994–2007
92Inventor score
Top patents by PatentIndex Score
15 records- 0197US5608136AMethod and apparatus for pyrolytically decomposing waste plasticTOSHIBA KK·Filed 1994·Granted Mar 4, 1997·158 cites·11 claims
- 0290US6172275B1Method and apparatus for pyrolytically decomposing waste plasticTOSHIBA KK·Filed 1998·Granted Jan 9, 2001·84 cites·8 claims
- 0389US6186390B1Solder material and method of manufacturing solder materialTOSHIBA KK·Filed 1998·Granted Feb 13, 2001·67 cites·21 claims
- 0487US6386426B1Solder material and method of manufacturing solder materialTOSHIBA KK·Filed 2000·Granted May 14, 2002·35 cites·15 claims
- 0584US7604154B2Thermosetting flux and solder pasteTOSHIBA KK·Filed 2007·Granted Oct 20, 2009·10 cites·9 claims
- 0683US6123248ASoldering method and soldering apparatusTOSHIBA KK·Filed 1998·Granted Sep 26, 2000·44 cites·9 claims
- 0781US6464122B1Soldering method and soldering apparatusKURODA TECHNO CO LTD·Filed 2000·Granted Oct 15, 2002·30 cites·5 claims
- 0873US6673310B2Solder material, device using the same and manufacturing process thereofTOSHIBA KK·Filed 2000·Granted Jan 6, 2004·19 cites·11 claims
- 0966US6220501B1Method of joining metallic members, and joined metallic membersTOSHIBA KK·Filed 1998·Granted Apr 24, 2001·30 cites·25 claims
- 1048US6949814B2Mounting material, semiconductor device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Granted Sep 27, 2005·3 cites·12 claims
- 1146US2006067853A1Lead free solderTOSHIBA KK·Filed 2005·Application pending·0 cites
- 1242US2005056687A1Thermosetting flux and solder pasteTOSHIBA KK·Filed 2004·Application pending·0 cites
- 1340US2006081995A1Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Application pending·0 cites
- 1440US2005218525A1Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Application pending·0 cites
- 1539US2004096688A1Lead-free joining material and joining method using the sameTOSHIBA KK·Filed 2003·Application pending·0 cites
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