Inventor · disambiguated record
Soon Seong Choi
Also filed as: CHOI SOON SEONG
4 granted patents·1 pending application·11 citations·filing 2018–2019
67Inventor score
Technology areasH10W
Files withJMJ KOREA CO LTD5
Top patents by PatentIndex Score
5 records- 0187US10855009B2Press-fit pin, semiconductor package having the same and method for manufacturing the press-fit pinJMJ KOREA CO LTD·Filed 2019·Granted Dec 1, 2020·7 cites·13 claims
- 0274US11367666B2Clip, lead frame, and substrate used in semiconductor package having engraved pattern formed thereon and the semiconductor package comprising the sameJMJ KOREA CO LTD·Filed 2018·Granted Jun 21, 2022·2 cites·35 claims
- 0371US10249552B2Semiconductor package having double-sided heat dissipation structureJMJ KOREA CO LTD·Filed 2018·Granted Apr 2, 2019·2 cites·5 claims
- 0444US10541197B2Press-fit pin and semiconductor package including the sameJMJ KOREA CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·13 claims
- 0538US2021166997A1Semiconductor package using conductive metal structureJMJ KOREA CO LTD·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →