Inventor · disambiguated record
Judith Marie Roldan
Also filed as: ROLDAN JUDITH M · ROLDAN JUDITH MARIE
26 granted patents·1 pending application·951 citations·filing 1990–1999
98Inventor score
Top patents by PatentIndex Score
27 records- 0195US5854514ALead-free interconnection for electronic devicesINT BUISNESS MACHINES CORP·Filed 1996·Granted Dec 29, 1998·100 cites·21 claims
- 0292US6005292ALead-free interconnection for electronic devicesIBM·Filed 1998·Granted Dec 21, 1999·68 cites·14 claims
- 0390US5922466AComposite comprising a metal substrate and a corrosion protecting layerIBM·Filed 1997·Granted Jul 13, 1999·41 cites·19 claims
- 0489US5543585ADirect chip attachment (DCA) with electrically conductive adhesivesIBM·Filed 1994·Granted Aug 6, 1996·103 cites·21 claims
- 0587US5700398AComposition containing a polymer and conductive filler and use thereofIBM·Filed 1994·Granted Dec 23, 1997·42 cites·13 claims
- 0685US5776587AElectronic package comprising a substrate and a semiconductor device bonded theretoIBM·Filed 1997·Granted Jul 7, 1998·30 cites·15 claims
- 0785US5747101ADirect chip attachment (DCA) with electrically conductive adhesivesIBM·Filed 1996·Granted May 5, 1998·72 cites·15 claims
- 0882US5997773AMethod for providing discharge protection or shieldingIBM·Filed 1999·Granted Dec 7, 1999·30 cites·36 claims
- 0979US5813870ASelectively filled adhesives for semiconductor chip interconnection and encapsulationIBM·Filed 1996·Granted Sep 29, 1998·55 cites·22 claims
- 1077US5985458AHousing for electromagnetic interference shieldingIBM·Filed 1997·Granted Nov 16, 1999·24 cites·20 claims
- 1177US5310580AElectroless metal adhesion to organic dielectric material with phase separated morphologyIBM·Filed 1992·Granted May 10, 1994·38 cites·16 claims
- 1274US5916486AMethod for providing discharge protection or shieldingIBM·Filed 1997·Granted Jun 29, 1999·20 cites·36 claims
- 1373US6127253ALead-free interconnection for electronic devicesIBM·Filed 1998·Granted Oct 3, 2000·26 cites·25 claims
- 1473US5897336ADirect chip attach for low alpha emission interconnect systemIBM·Filed 1997·Granted Apr 27, 1999·42 cites·43 claims
- 1571US6015509AComposition containing a polymer and conductive filler and use thereofIBM·Filed 1997·Granted Jan 18, 2000·19 cites·16 claims
- 1671US5048744APalladium enhanced fluxless soldering and bonding of semiconductor device contactsIBM·Filed 1990·Granted Sep 17, 1991·47 cites·19 claims
- 1769US5866044ALead free conductive composites for electrical interconnectionsIBM·Filed 1996·Granted Feb 2, 1999·32 cites·4 claims
- 1866US6099939AEnhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphologyIBM·Filed 1997·Granted Aug 8, 2000·35 cites·20 claims
- 1965US6174606B1Corrosion and dissolution protection of a conductive silver/polymer compositeIBM·Filed 1997·Granted Jan 16, 2001·25 cites·24 claims
- 2064US5545429AFabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocessIBM·Filed 1994·Granted Aug 13, 1996·25 cites·47 claims
- 2163US6013713AElectrode modification using an unzippable polymer pasteIBM·Filed 1997·Granted Jan 11, 2000·18 cites·5 claims
- 2261US6197222B1Lead free conductive composites for electrical interconnectionsIBM·Filed 1998·Granted Mar 6, 2001·22 cites·4 claims
- 2359US6281105B1Electrode modification using an unzippable polymer pasteIBM·Filed 1999·Granted Aug 28, 2001·14 cites·4 claims
- 2443US5225711APalladium enhanced soldering and bonding of semiconductor device contactsIBM·Filed 1991·Granted Jul 6, 1993·13 cites·9 claims
- 2539US6221503B1Electrode modification using an unzippable polymer pasteIBM·Filed 1999·Granted Apr 24, 2001·5 cites·6 claims
- 2632US5834405ASuperconducting multilayer ceramic substrateIBM·Filed 1992·Granted Nov 10, 1998·5 cites·35 claims
- 2730US2002005247A1Electrically conductive paste materials and applicationsFiled 1999·Application pending·0 cites
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