Inventor · disambiguated record
Fumiyuki Kanai
Also filed as: KANAI FUMIYUKI
18 granted patents·391 citations·filing 1991–2010
95Inventor score
Top patents by PatentIndex Score
18 records- 0190US5449411AMicrowave plasma processing apparatusHITACHI LTD·Filed 1993·Granted Sep 12, 1995·82 cites·16 claims
- 0287US7250365B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted Jul 31, 2007·10 cites·6 claims
- 0384US5444012AMethod for manufacturing semiconductor integrated circuit device having a fuse elementHITACHI LTD·Filed 1994·Granted Aug 22, 1995·84 cites·12 claims
- 0482US7977234B2Fabrication method of semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 12, 2011·4 cites·16 claims
- 0582US5896150AInk-jet type recording headSEIKO EPSON CORP·Filed 1993·Granted Apr 20, 1999·40 cites·6 claims
- 0673US6979649B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Dec 27, 2005·12 cites·15 claims
- 0772US5508540ASemiconductor integrated circuit device and process of manufacturing the sameHITACHI LTD·Filed 1994·Granted Apr 16, 1996·30 cites·24 claims
- 0870US7718526B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted May 18, 2010·2 cites·4 claims
- 0965US5188975AMethod of producing a connection hole for a DRAM having at least three conductor layers in a self alignment manner.HITACHI LTD·Filed 1992·Granted Feb 23, 1993·38 cites·15 claims
- 1060US5880497ASemiconductor integrated circuit device having capacitance element and process of manufacturing the sameHITACHI LTD·Filed 1996·Granted Mar 9, 1999·18 cites·30 claims
- 1156US5670409AMethod of fabricating a semiconductor IC DRAM device enjoying enhanced focus marginHITACHI LTD·Filed 1995·Granted Sep 23, 1997·14 cites·10 claims
- 1255US6307217B1Semiconductor memory device having driver and load MISFETs and capacitor elementsHITACHI LTD·Filed 1994·Granted Oct 23, 2001·15 cites·36 claims
- 1354US5230731AHot-melt ink compositionSEIKO EPSON CORP·Filed 1991·Granted Jul 27, 1993·16 cites·19 claims
- 1448US6309057B1Ink-jet type recording headSEIKO EPSON CORP·Filed 1999·Granted Oct 30, 2001·9 cites·16 claims
- 1546US7052995B2Process of manufacturing semiconductor device including chemical-mechanical polishingRENESAS TECH CORP·Filed 2002·Granted May 30, 2006·2 cites·23 claims
- 1644US7905562B2Liquid guiding device and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2007·Granted Mar 15, 2011·0 cites·6 claims
- 1744US6512245B2Semiconductor integrated circuit deviceHITACHI LTD·Filed 2001·Granted Jan 28, 2003·2 cites·9 claims
- 1843US5347100ASemiconductor device, process for the production thereof and apparatus for microwave plasma treatmentHITACHI LTD·Filed 1992·Granted Sep 13, 1994·13 cites·11 claims
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