Inventor · disambiguated record

Brian Lynn Rowden

Also filed as: LYNN ROWDEN BRIAN

1 granted patent·1 citations·filing 2010–2010

16Inventor score

Technology areasH10W

Files withOTSUKA TAKUKAZU1

Top patents by PatentIndex Score

1 record

0154US8592986B2High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor deviceOTSUKA TAKUKAZU·Filed 2010·Granted Nov 26, 2013·1 cites·10 claims

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