Inventor · disambiguated record
Tomihiro Hara
Also filed as: HARA TOMIHIRO
9 granted patents·6 pending applications·285 citations·filing 1981–2009
90Inventor score
Top patents by PatentIndex Score
15 records- 0190US4411964AComposite coating steel sheets having good corrosion resistance paintability and corrosion resistance after paint coatingNIPPON KOKAN KK·Filed 1981·Granted Oct 25, 1983·58 cites·25 claims
- 0290US4407899ASurface treated steel sheets for paint coatingNIPPON KOKAN KK·Filed 1981·Granted Oct 4, 1983·56 cites·12 claims
- 0389US4659394AProcess for preparation of highly anticorrosive surface-treated steel plateNIPPON KOKAN KK·Filed 1984·Granted Apr 21, 1987·55 cites·25 claims
- 0489US4519878AMethod of Fe-Zn alloy electroplatingNIPPON KOKAN KK·Filed 1983·Granted May 28, 1985·36 cites·1 claims
- 0585US4543300AIron-zinc alloy electro-galvanized steel sheet having a plurality of iron-zinc alloy coatingsNIPPON KOKAN KK·Filed 1984·Granted Sep 24, 1985·32 cites·10 claims
- 0675US4487663ASteel sheets for preparing welded and coated cans and method for manufacturing the sameNIPPON KOKAN KK·Filed 1983·Granted Dec 11, 1984·17 cites·7 claims
- 0764US4450209AMulti-layer surface-treated steel plate having zinc-containing layerNIPPON KOKAN KK·Filed 1982·Granted May 22, 1984·16 cites·8 claims
- 0853US5462686AMethod of manufacturing composite ferriteNIPPON KOKAN KK·Filed 1994·Granted Oct 31, 1995·13 cites·14 claims
- 0950US2011139500A1Electrical connecting method and electrically connected connection structureHARA TOMIHIRO·Filed 2009·Application pending·0 cites
- 1048US2004213973A1Film adhesive for sealing, film laminate for sealing and sealing methodFiled 2004·Application pending·0 cites
- 1145US2011000700A1Method of connecting circuit boards and connected structureSATO YOSHIAKI·Filed 2007·Application pending·0 cites
- 1243US2004063804A1Thermosetting adhesiveFiled 2002·Application pending·0 cites
- 1337US2004068061A1Thermosetting adhesive film, and an adhesive structure based on the use thereofFiled 2002·Application pending·0 cites
- 1436US2009321015A1Adhesive composition comprising polyhydroxyether and organic particles, and method for connecting circuit board using the sameKAWATE KOHICHIRO·Filed 2007·Application pending·0 cites
- 1529US4757781AApparatus of hot dip plating on one side of stripNIPPON KOKAN KK·Filed 1987·Granted Jul 19, 1988·2 cites·4 claims
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