Inventor · disambiguated record

Yick Hong Mak

Also filed as: MAK YICK HONG

1 granted patent·41 citations·filing 2012–2012

47Inventor score

Technology areasH10W

Files withCHEUNG YIU MING1

Top patents by PatentIndex Score

1 record

0187US8967452B2Thermal compression bonding of semiconductor chipsCHEUNG YIU MING·Filed 2012·Granted Mar 3, 2015·41 cites·20 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →

Yick Hong Mak — Patent Inventor | PatentIndex