Inventor · disambiguated record
Friedrich W. Schwerdt
Also filed as: SCHWERDT FRIEDRICH · SCHWERDT FRIEDRICH W · SCHWERDT FRIEDRICH WILHELM
9 granted patents·281 citations·filing 1976–1987
90Inventor score
Files withIBM9
Top patents by PatentIndex Score
9 records- 0189US4152195AMethod of improving the adherence of metallic conductive lines on polyimide layersIBM·Filed 1977·Granted May 1, 1979·94 cites·7 claims
- 0286US4642163AMethod of making adhesive metal layers on substrates of synthetic material and device produced therebyIBM·Filed 1983·Granted Feb 10, 1987·37 cites·8 claims
- 0380US4705592AProcess for producing printed circuitsIBM·Filed 1986·Granted Nov 10, 1987·50 cites·17 claims
- 0476US4556628AProcess for producing printed circuit boards with metallic conductor structures embedded in the insulating substrateIBM·Filed 1984·Granted Dec 3, 1985·32 cites·8 claims
- 0575US4039371AEtchant for polyimidesIBM·Filed 1976·Granted Aug 2, 1977·32 cites·3 claims
- 0649US4521280AMethod of making printed circuits with one conductor planeIBM·Filed 1984·Granted Jun 4, 1985·12 cites·12 claims
- 0743US4857383ASynthetic substrate with adhesive metal layerIBM·Filed 1987·Granted Aug 15, 1989·5 cites·2 claims
- 0843US4117093AMethod of making an amorphous silicon dioxide free of metal ionsIBM·Filed 1977·Granted Sep 26, 1978·11 cites·5 claims
- 0942US4540464AMethod of renewing defective copper conductors on the external planes of multilayer circuit boardsIBM·Filed 1984·Granted Sep 10, 1985·8 cites·15 claims
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