Inventor · disambiguated record
Motoru Yoshida
Also filed as: YOSHIDA Motoru
10 granted patents·5 pending applications·4 citations·filing 2014–2024
78Inventor score
Files withMITSUBISHI ELECTRIC CORP15
Top patents by PatentIndex Score
15 records- 0173US10707146B2Semiconductor device and method for manufacturing same, for releaved stress and high heat conductivityMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 7, 2020·2 cites·12 claims
- 0269US9842738B2Method for manufacturing silicon carbide semiconductor device and silicon carbide semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Dec 12, 2017·2 cites·18 claims
- 0360US2025203924A1Semiconductor device, method of manufacturing semiconductor device, and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0459US2024297229A1Silicon carbide semiconductor device and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0557US10697078B2Method of forming Cu plating, method of manufacturing Cu-plated substrate, and Cu-plated substrateMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 30, 2020·0 cites·5 claims
- 0653US12322605B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jun 3, 2025·0 cites·17 claims
- 0746US11830795B2Semiconductor device, power conversion device, and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Nov 28, 2023·0 cites·10 claims
- 0845US11195803B2Semiconductor element, semiconductor device, power conversion device, and method of manufacturing semiconductor elementMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Dec 7, 2021·0 cites·13 claims
- 0945US2023215942A1Semiconductor device, power conversion apparatus, and method for producing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1045US2023290874A1Method of manufacturing silicon carbide semiconductor device, silicon carbide semiconductor device, and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1140US10529587B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jan 7, 2020·0 cites·9 claims
- 1240US10276502B2Semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Apr 30, 2019·0 cites·23 claims
- 1338US2020273716A1Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 1436US11158511B2Semiconductor device and power converter including a copper film with a small grain size stress relaxtion layerMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 26, 2021·0 cites·6 claims
- 1533US9721915B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 1, 2017·0 cites·14 claims
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