Inventor · disambiguated record
Peter J. Brofman
Also filed as: BROFMAN PETER J · BROFMAN PETER JEFFREY
35 granted patents·1,073 citations·filing 1991–2015
98Inventor score
Top patents by PatentIndex Score
35 records- 0199US6258625B1Method of interconnecting electronic components using a plurality of conductive studsIBM·Filed 1999·Granted Jul 10, 2001·243 cites·14 claims
- 0295US6270363B1Z-axis compressible polymer with fine metal matrix suspensionIBM·Filed 1999·Granted Aug 7, 2001·105 cites·24 claims
- 0393US7709951B2Thermal pillowIBM·Filed 2007·Granted May 4, 2010·27 cites·20 claims
- 0493US6283359B1Method for enhancing fatigue life of ball grid arraysIBM·Filed 2000·Granted Sep 4, 2001·53 cites·5 claims
- 0591US9698072B2Low-stress dual underfill packagingIBM·Filed 2015·Granted Jul 4, 2017·8 cites·5 claims
- 0690US8870051B2Flip chip assembly apparatus employing a warpage-suppressor assemblyBROFMAN PETER J·Filed 2012·Granted Oct 28, 2014·15 cites·25 claims
- 0789US6878608B2Method of manufacture of silicon based packageIBM·Filed 2001·Granted Apr 12, 2005·54 cites·16 claims
- 0888US6184062B1Process for forming cone shaped solder for chip interconnectionIBM·Filed 1999·Granted Feb 6, 2001·56 cites·71 claims
- 0985US6559527B2Process for forming cone shaped solder for chip interconnectionIBM·Filed 2001·Granted May 6, 2003·28 cites·20 claims
- 1082US6158644AMethod for enhancing fatigue life of ball grid arraysIBM·Filed 1998·Granted Dec 12, 2000·43 cites·9 claims
- 1181US7875502B2Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/cornersIBM·Filed 2010·Granted Jan 25, 2011·5 cites·9 claims
- 1281US5968670AEnhanced ceramic ball grid array using in-situ solder stretch with springIBM·Filed 1997·Granted Oct 19, 1999·63 cites·17 claims
- 1380US7733655B2Lid edge capping loadIBM·Filed 2008·Granted Jun 8, 2010·11 cites·16 claims
- 1475US9373559B2Low-stress dual underfill packagingIBM·Filed 2014·Granted Jun 21, 2016·3 cites·4 claims
- 1574US6278184B1Solder disc connectionIBM·Filed 1999·Granted Aug 21, 2001·35 cites·14 claims
- 1674US5964396AEnhanced ceramic ball grid array using in-situ solder stretch with clipIBM·Filed 1997·Granted Oct 12, 1999·36 cites·15 claims
- 1774US5284286APorous metal block for removing solder or braze from a substate and a process for making the sameIBM·Filed 1991·Granted Feb 8, 1994·31 cites·9 claims
- 1870US8978960B2Flip chip assembly apparatus employing a warpage-suppressor assemblyIBM·Filed 2014·Granted Mar 17, 2015·2 cites·15 claims
- 1969US8493746B2Additives for grain fragmentation in Pb-free Sn-based solderARVIN CHARLES L·Filed 2010·Granted Jul 23, 2013·2 cites·14 claims
- 2069US6220499B1Method for assembling a chip carrier to a semiconductor deviceIBM·Filed 1998·Granted Apr 24, 2001·30 cites·7 claims
- 2169US5831810AElectronic component package with decoupling capacitors completely within die receiving cavity of substrateIBM·Filed 1996·Granted Nov 3, 1998·41 cites·17 claims
- 2268US6548909B2Method of interconnecting electronic components using a plurality of conductive studsIBM·Filed 2001·Granted Apr 15, 2003·11 cites·12 claims
- 2368US5975409ACeramic ball grid array using in-situ solder stretchIBM·Filed 1997·Granted Nov 2, 1999·36 cites·5 claims
- 2467US6253986B1Solder disc connectionIBM·Filed 1999·Granted Jul 3, 2001·25 cites·5 claims
- 2567US5219520AProcess of making a porous metal block for removing solder or brazeIBM·Filed 1992·Granted Jun 15, 1993·24 cites·28 claims
- 2666US6984792B2Dielectric interposer for chip to substrate solderingIBM·Filed 2003·Granted Jan 10, 2006·9 cites·14 claims
- 2760US7732932B2Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/cornersIBM·Filed 2007·Granted Jun 8, 2010·1 cites·31 claims
- 2860US6070321ASolder disc connectionIBM·Filed 1997·Granted Jun 6, 2000·20 cites·12 claims
- 2956US6218629B1Module with metal-ion matrix induced dendrites for interconnectionIBM·Filed 1999·Granted Apr 17, 2001·18 cites·11 claims
- 3053US8910853B2Additives for grain fragmentation in Pb-free Sn-based solderIBM·Filed 2013·Granted Dec 16, 2014·0 cites·17 claims
- 3152US5868304ASocketable bump grid array shaped-solder on copper spheresIBM·Filed 1996·Granted Feb 9, 1999·19 cites·9 claims
- 3249US6584684B2Method for assembling a carrier and a semiconductor deviceIBM·Filed 2001·Granted Jul 1, 2003·3 cites·16 claims
- 3339US6657313B1Dielectric interposer for chip to substrate solderingIBM·Filed 1999·Granted Dec 2, 2003·7 cites·12 claims
- 3434US6016947ANon-destructive low melt test for off-composition solderIBM·Filed 1997·Granted Jan 25, 2000·6 cites·20 claims
- 3532US6070782ASocketable bump grid array shaped-solder on copper spheresIBM·Filed 1998·Granted Jun 6, 2000·3 cites·5 claims
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