Inventor · disambiguated record
Jr-Lin Hsu
Also filed as: HSU JR-LIN
3 granted patents·6 citations·filing 2019–2021
61Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0187US11011487B2Semiconductor package having varying conductive pad sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 18, 2021·2 cites·20 claims
- 0286US10700030B2Semiconductor package having varying conductive pad sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 30, 2020·4 cites·20 claims
- 0371US11699673B2Semiconductor package having varying conductive pad sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →