Inventor · disambiguated record
Chung-Chih Chen
Also filed as: CHEN CHUNG-CHIH
13 granted patents·12 pending applications·73 citations·filing 2000–2025
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8UNITED MICROELECTRONICS CORP6CHEN CHUNG-CHIH4IND TECH RES INST2AFREEY INC1
Top patents by PatentIndex Score
25 records- 0194US9781857B2Hot swappable component quick releaseQUANTA COMP INC·Filed 2015·Granted Oct 3, 2017·14 cites·12 claims
- 0287US11011487B2Semiconductor package having varying conductive pad sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 18, 2021·2 cites·20 claims
- 0386US10700030B2Semiconductor package having varying conductive pad sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 30, 2020·4 cites·20 claims
- 0486US10269669B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·7 cites·20 claims
- 0576US6251804B1Method for enhancing adhesion of photo-resist to silicon nitride surfacesUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jun 26, 2001·21 cites·11 claims
- 0676US2025343170A1Package connectors in semiconductor packages and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0771US11699673B2Semiconductor package having varying conductive pad sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 0871US7257431B2Electric swiveling mechanism for two axesAFREEY INC·Filed 2005·Granted Aug 14, 2007·14 cites·20 claims
- 0970US2025046734A1Package connectors in semicondcutor packages and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1064US7709878B2Capacitor structure having butting conductive layerUNITED MICROELECTRONICS CORP·Filed 2007·Granted May 4, 2010·3 cites·9 claims
- 1162US8831021B2System and method for dynamically configurable multi-window divergent protocol bridgeDEIVASIGAMANI VINOTH KUMAR·Filed 2011·Granted Sep 9, 2014·2 cites·38 claims
- 1262US8242712B2Power supply apparatusCHEN WEN-SHENG·Filed 2009·Granted Aug 14, 2012·2 cites·14 claims
- 1356US2024371816A1Radiant substrate heating for thermocompressive bonding and apparatus for implementing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1453US10872831B2Method of forming a semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 1549US6500355B1Wafer conductive structure for preventing plasma damageUNITED MICROELECTRONICS CORP·Filed 2000·Granted Dec 31, 2002·4 cites·20 claims
- 1649US2009184402A1Method of fabricating a shallow trench isolation structure including forming a second liner covering the corner of the trench and first liner.UNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 1747US2008156708A1Extracted liquid automatic collecting equipmentIND TECH RES INST·Filed 2007·Application pending·0 cites
- 1846US2009285419A1Microelectromechanical system microphoneUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 1944US2010289117A1Shallow trench isolation structure including second liner covering corner of trench and first linerUNITED MICROELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 2040US2014335672A1Process for manufacturing semiconductor transistor deviceUNITED MICROELETRONICS CORP·Filed 2013·Application pending·0 cites
- 2138US10601677B2Device and method for a dynamic virtual private network and computer readable recording mediumCHEN CHUNG CHIH·Filed 2018·Granted Mar 24, 2020·0 cites·14 claims
- 2238US2009283714A1Etching gas for removing organic layersCHEN CHUNG-CHIH·Filed 2008·Application pending·0 cites
- 2334US2007077184A1Environmental dynamic leaching/extraction deviceIND TECH RES INST·Filed 2005·Application pending·0 cites
- 2433US2007218697A1Method for removing polymer from wafer and method for removing polymer in interconnect processCHEN CHUNG-CHIH·Filed 2006·Application pending·0 cites
- 2531US2006011224A1Extrusion free wet cleaning processCHEN CHUNG-CHIH·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →