Inventor · disambiguated record
Tasuku Koyanagi
Also filed as: KOYANAGI TASUKU
14 granted patents·7 pending applications·31 citations·filing 2011–2025
86Inventor score
Top patents by PatentIndex Score
21 records- 0192US8148184B2Optical device wafer processing methodKOYANAGI TASUKU·Filed 2011·Granted Apr 3, 2012·20 cites·6 claims
- 0284US11211296B2Comparing method and laser processing apparatusDISCO CORP·Filed 2020·Granted Dec 28, 2021·2 cites·2 claims
- 0382US9531154B2Lift-off methodDISCO CORP·Filed 2015·Granted Dec 27, 2016·4 cites·2 claims
- 0480US9530929B2Lift-off methodDISCO CORP·Filed 2015·Granted Dec 27, 2016·2 cites·11 claims
- 0577US10916679B2Optical device wafer processing methodDISCO CORP·Filed 2019·Granted Feb 9, 2021·1 cites·7 claims
- 0677US10854774B2Lift-off methodDISCO CORP·Filed 2018·Granted Dec 1, 2020·1 cites·7 claims
- 0771US10658220B2Device transferring methodDISCO CORP·Filed 2019·Granted May 19, 2020·1 cites·4 claims
- 0871US2025153270A1Inspection method for laser processing apparatusDISCO CORP·Filed 2024·Application pending·0 cites
- 0966US2023191539A1Laser processing apparatusDISCO CORP·Filed 2022·Application pending·0 cites
- 1055US11552214B2Lift-off method and laser processing apparatusDISCO CORP·Filed 2021·Granted Jan 10, 2023·0 cites·1 claims
- 1155US2020095670A1Method for forming adherend with optical thin filmDISCO CORP·Filed 2019·Application pending·0 cites
- 1254US2025357156A1Method for reusing a supporting wafer and method for manufacturing chipsDISCO CORP·Filed 2025·Application pending·0 cites
- 1352US2024128086A1Method of processing waferDISCO CORP·Filed 2023·Application pending·0 cites
- 1445US11600527B2Lift-off method for transferring optical device layerDISCO CORP·Filed 2019·Granted Mar 7, 2023·0 cites·6 claims
- 1545US11011670B2Optical device layer transferring methodDISCO CORP·Filed 2020·Granted May 18, 2021·0 cites·1 claims
- 1643US8178425B2Optical device wafer processing methodKOYANAGI TASUKU·Filed 2011·Granted May 15, 2012·0 cites·6 claims
- 1742US10886159B2Method of processing waferDISCO CORP·Filed 2018·Granted Jan 5, 2021·0 cites·8 claims
- 1842US2011195537A1Optical device wafer processing methodDISCO CORP·Filed 2011·Application pending·0 cites
- 1941US9511579B2Separation apparatusDISCO CORP·Filed 2015·Granted Dec 6, 2016·0 cites·1 claims
- 2038US9793166B2Lift-off methodDISCO CORP·Filed 2015·Granted Oct 17, 2017·0 cites·11 claims
- 2137US2011186554A1Wafer dividing method using co2 laserDISCO CORP·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →