Inventor · disambiguated record
Ravi Kiran Nalla
Also filed as: NALLA RAVI · NALLA RAVI K · NALLA RAVI KIRAN
49 granted patents·19 pending applications·287 citations·filing 2006–2025
98Inventor score
Top patents by PatentIndex Score
68 records- 0197US8304913B2Methods of forming fully embedded bumpless build-up layer packages and structures formed therebyNALLA RAVI K·Filed 2010·Granted Nov 6, 2012·46 cites·11 claims
- 0296US8618652B2Forming functionalized carrier structures with coreless packagesNALLA RAVI K·Filed 2010·Granted Dec 31, 2013·30 cites·15 claims
- 0396US8319318B2Forming metal filled die back-side film for electromagnetic interference shielding with coreless packagesNALLA RAVI K·Filed 2010·Granted Nov 27, 2012·42 cites·16 claims
- 0494US8431438B2Forming in-situ micro-feature structures with coreless packagesNALLA RAVI K·Filed 2010·Granted Apr 30, 2013·17 cites·13 claims
- 0591US8901724B2Semiconductor package with embedded die and its methods of fabricationGUZEK JOHN STEPHEN·Filed 2009·Granted Dec 2, 2014·28 cites·7 claims
- 0689US8786066B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2010·Granted Jul 22, 2014·11 cites·36 claims
- 0789US8772924B2Forming in-situ micro-feature structures with coreless packagesINTEL CORP·Filed 2013·Granted Jul 8, 2014·7 cites·7 claims
- 0888US8580616B2Methods of forming fully embedded bumpless build-up layer packages and structures formed therebyNALLA RAVI K·Filed 2012·Granted Nov 12, 2013·8 cites·13 claims
- 0988US8508037B2Bumpless build-up layer and laminated core hybrid structures and methods of assembling sameMANUSHAROW MATHEW J·Filed 2010·Granted Aug 13, 2013·9 cites·15 claims
- 1087US10469758B2Structured light 3D sensors with variable focal length lenses and illuminatorsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Nov 5, 2019·4 cites·19 claims
- 1187US9851478B2Optical cross talk mitigation for optical device having disrupting features formed on a shieldMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Dec 26, 2017·6 cites·20 claims
- 1286US10602039B2Ultra-compact image sensor assembly for thin profile devicesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Mar 24, 2020·4 cites·23 claims
- 1385US7651021B2Microball attachment using self-assembly for substrate bumpingINTEL CORP·Filed 2007·Granted Jan 26, 2010·13 cites·20 claims
- 1481US10430647B2Tailored illumination profile for articulated hand trackingMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2017·Granted Oct 1, 2019·3 cites·17 claims
- 1580US7538429B2Method of enabling solder deposition on a substrate and electronic package formed therebyINTEL CORP·Filed 2006·Granted May 26, 2009·8 cites·11 claims
- 1679US10372974B23D imaging recognition by stereo matching of RGB and infrared imagesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2017·Granted Aug 6, 2019·3 cites·9 claims
- 1778US9769398B2Image sensor with large-area global shutter contactMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Sep 19, 2017·2 cites·20 claims
- 1877US9411122B2Light field image capture device having 2D image capture modeLYTRO INC·Filed 2015·Granted Aug 9, 2016·2 cites·7 claims
- 1977US7583871B1Substrates for optical die structuresBCHIR OMAR J·Filed 2008·Granted Sep 1, 2009·8 cites·23 claims
- 2075US9077901B2Light field image capture device having 2D image capture modeLYTRO INC·Filed 2014·Granted Jul 7, 2015·2 cites·28 claims
- 2173US10386486B2Systems and methods for time of flight laser pulse engineeringMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Aug 20, 2019·2 cites·20 claims
- 2271US7831115B2Optical die structures and associated package substratesINTEL CORP·Filed 2008·Granted Nov 9, 2010·2 cites·23 claims
- 2370US9780054B2Semiconductor package with embedded die and its methods of fabricationINTEL CORP·Filed 2014·Granted Oct 3, 2017·2 cites·13 claims
- 2470US7825022B2Method of enabling solder deposition on a substrate and electronic package formed therebyINTEL CORP·Filed 2009·Granted Nov 2, 2010·4 cites·13 claims
- 2569US8507324B2Forming metal filled die back-side film for electromagnetic interference shielding with coreless packagesNALLA RAVI K·Filed 2012·Granted Aug 13, 2013·2 cites·13 claims
- 2668US10154197B2Image capture device having light field image capture mode, 2D image capture mode, and intermediate capture modeGOOGLE LLC·Filed 2016·Granted Dec 11, 2018·1 cites·28 claims
- 2767US11189275B2Natural language processing while sound sensor is mutedPOLYCOM INC·Filed 2018·Granted Nov 30, 2021·2 cites·10 claims
- 2867US9040842B2Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillersINTEL CORP·Filed 2013·Granted May 26, 2015·1 cites·12 claims
- 2967US7776734B2Barrier layer for fine-pitch mask-based substrate bumpingINTEL CORP·Filed 2006·Granted Aug 17, 2010·3 cites·12 claims
- 3067US7494913B2Microball placement solutionsINTEL CORP·Filed 2006·Granted Feb 24, 2009·5 cites·22 claims
- 3166US7985622B2Method of forming collapse chip connection bumps on a semiconductor substrateINTEL CORP·Filed 2008·Granted Jul 26, 2011·3 cites·16 claims
- 3265US9726962B1Enhanced camera module mountNALLA RAVI·Filed 2016·Granted Aug 8, 2017·1 cites·18 claims
- 3365US8252677B2Method of forming solder bumps on substratesBCHIR OMAR·Filed 2007·Granted Aug 28, 2012·3 cites·5 claims
- 3463US10652475B2Structured light 3D sensors with variable focal length lenses and illuminatorsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2019·Granted May 12, 2020·0 cites·20 claims
- 3562US10003726B2Illumination module for near eye-to-eye display systemMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Jun 19, 2018·1 cites·14 claims
- 3659US8425785B2Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillersNALLA RAVI·Filed 2008·Granted Apr 23, 2013·2 cites·10 claims
- 3758US10521650B23D imaging recognition by stereo matching of RGB and infrared imagesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2019·Granted Dec 31, 2019·0 cites·20 claims
- 3858US9214439B2Forming in-situ micro-feature structures with coreless packagesINTEL CORP·Filed 2014·Granted Dec 15, 2015·0 cites·12 claims
- 3955US2019208630A1Laser diode chip on printed circuit boardMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2019·Application pending·0 cites
- 4054US8809124B2Bumpless build-up layer and laminated core hybrid structures and methods of assembling sameINTEL CORP·Filed 2013·Granted Aug 19, 2014·0 cites·20 claims
- 4153US9406618B2Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameINTEL CORP·Filed 2014·Granted Aug 2, 2016·0 cites·32 claims
- 4253US8896116B2Microelectronic package and method of manufacturing sameNALLA RAVI K·Filed 2013·Granted Nov 25, 2014·0 cites·13 claims
- 4352US9257380B2Forming functionalized carrier structures with coreless packagesINTEL CORP·Filed 2015·Granted Feb 9, 2016·0 cites·18 claims
- 4451US9929097B2Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillersNALLA RAVI·Filed 2015·Granted Mar 27, 2018·0 cites·9 claims
- 4551US2013228911A1Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing sameMANUSHAROW MATHEW J·Filed 2013·Application pending·0 cites
- 4650US10257932B2Laser diode chip on printed circuit boardMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Apr 9, 2019·0 cites·20 claims
- 4750US10048498B2Illumination moduleMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Aug 14, 2018·0 cites·20 claims
- 4850US2009061232A1Methods of laser surface modification of ceramic packages for underfill spread control and structures formed therebyNALLA RAVI K·Filed 2008·Application pending·0 cites
- 4950US2014327149A1Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming sameGUZEK JOHN S·Filed 2014·Application pending·0 cites
- 5049US10051723B2High thermal conductivity region for optoelectronic devicesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Aug 14, 2018·0 cites·17 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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