Inventor · disambiguated record
Teak-Hoon Lee
Also filed as: LEE TEAK-HOON
25 granted patents·14 pending applications·201 citations·filing 2007–2025
95Inventor score
Top patents by PatentIndex Score
39 records- 0197US7807512B2Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 5, 2010·115 cites·20 claims
- 0294US11923343B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 5, 2024·2 cites·20 claims
- 0393US10930613B2Semiconductor package having recessed adhesive layer between stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·9 cites·17 claims
- 0493US8455301B2Method of fabricating stacked chips in a semiconductor packageLEE TEAK-HOON·Filed 2011·Granted Jun 4, 2013·25 cites·26 claims
- 0592US11848293B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·19 claims
- 0692US9721930B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 1, 2017·11 cites·18 claims
- 0786US8637350B2Method of manufacturing chip-stacked semiconductor packageAHN JUNG-SEOK·Filed 2012·Granted Jan 28, 2014·9 cites·20 claims
- 0884US8637969B2Stacked chips in a semiconductor packageLEE TEAK-HOON·Filed 2013·Granted Jan 28, 2014·7 cites·10 claims
- 0984US2025300140A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1084US2025062248A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1182US12362328B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 1280US8093703B2Semiconductor package having buried post in encapsulant and method of manufacturing the sameKIM PYOUNG-WAN·Filed 2008·Granted Jan 10, 2012·10 cites·46 claims
- 1379US12165991B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1476US2024429205A1Semiconductor package with increased thermal radiation efficiencySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1576US2025167137A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1675US12400980B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 1773US2024379626A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1872US11594499B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 1971US10867857B2Method of cutting substrate and method of singulating semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·14 claims
- 2070US11538792B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·20 claims
- 2170US9136260B2Method of manufacturing chip-stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 2269US8008771B2Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 30, 2011·4 cites·19 claims
- 2368US9159651B2Semiconductor packages having TSV and adhesive layerSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 13, 2015·2 cites·16 claims
- 2466US12074141B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·13 claims
- 2565US12113050B2Semiconductor package with increased thermal radiation efficiencySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 8, 2024·0 cites·17 claims
- 2661US8344497B2Semiconductor package and electronic device having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 1, 2013·2 cites·12 claims
- 2757US2025174573A1Packaged semiconductor chips having protected identification marks thereinSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2852US2009298234A1Method of fabricating semiconductor chip package, semiconductor wafer, and method of sawing the semiconductor waferLEE TEAK-HOON·Filed 2009·Application pending·0 cites
- 2950US8987904B2Substrate of semiconductor package and method of fabricating semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 24, 2015·0 cites·13 claims
- 3049US2008284017A1Methods of fabricating circuit board and semiconductor package, and circuit board and semiconductor package fabricated using the methodsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3147US8846446B2Semiconductor package having buried post in encapsulant and method of manufacturing the sameKIM PYOUNG-WAN·Filed 2011·Granted Sep 30, 2014·0 cites·10 claims
- 3247US8154122B2Semiconductor package and methods of manufacturing the semiconductor packageJANG CHUL-YONG·Filed 2009·Granted Apr 10, 2012·0 cites·11 claims
- 3347US2010013076A1Semiconductor device package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3446US2009134528A1Semiconductor package, electronic device including the semiconductor package, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3545US9082871B2Substrate of semiconductor package and method of fabricating semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 14, 2015·0 cites·10 claims
- 3645US2008092360A1Thin semiconductor chip pickup apparatus and methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3743US2008265432A1Multi-chip package and method of manufacturing the multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3838US2013149817A1Fabricating methods of semiconductor devices and pick-up apparatuses of semiconductor devices thereinJEON CHANG-SEONG·Filed 2012·Application pending·0 cites
- 3934US2013032947A1Semiconductor package and method of manufacturing the samePARK SANG-SICK·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →