Inventor · disambiguated record
Masaomi Miyazawa
Also filed as: MIYAZAWA MASAOMI
8 granted patents·1 pending application·5 citations·filing 2013–2025
76Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP9
Top patents by PatentIndex Score
9 records- 0170US9171776B2Semiconductor cooling deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Oct 27, 2015·2 cites·18 claims
- 0266US9123697B2Semiconductor cooling deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Sep 1, 2015·2 cites·3 claims
- 0361US9397014B2Semiconductor device having laterally-extending electrode with reduced inductanceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jul 19, 2016·1 cites·26 claims
- 0457US12272624B2Semiconductor device having lead connecting a semiconductor chip to a frame and projection extending from frame and a method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Apr 8, 2025·0 cites·17 claims
- 0552US10790242B2Method of manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Sep 29, 2020·0 cites·3 claims
- 0650US10347593B2Semiconductor device and method of manufacturing the semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 9, 2019·0 cites·7 claims
- 0748US12334427B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Jun 17, 2025·0 cites·8 claims
- 0848US2025385144A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0938US9721861B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Aug 1, 2017·0 cites·11 claims
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