Inventor · disambiguated record
Jae-Phil Boo
Also filed as: BOO JAE-PHIL
22 granted patents·2 pending applications·336 citations·filing 2001–2013
96Inventor score
Top patents by PatentIndex Score
24 records- 0195US6383882B1Method for fabricating MOS transistor using selective silicide processSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 7, 2002·113 cites·15 claims
- 0292US6626968B2Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 30, 2003·53 cites·27 claims
- 0390US8734206B2Polishing pad for chemical mechanical polishing process and chemical mechanical polishing apparatus including the sameCHANG ONE-MOON·Filed 2011·Granted May 27, 2014·21 cites·11 claims
- 0485US7081045B2Apparatus for polishing a semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 25, 2006·7 cites·22 claims
- 0584US6945861B2Polishing head of chemical mechanical polishing apparatus and polishing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 20, 2005·8 cites·9 claims
- 0683US6652362B2Apparatus for polishing a semiconductor wafer and method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 25, 2003·21 cites·12 claims
- 0781US8662956B2Conditioner of chemical mechanical polishing apparatusSEO KEON SIK·Filed 2011·Granted Mar 4, 2014·10 cites·11 claims
- 0879US7223158B2Method for polishing a semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 29, 2007·4 cites·10 claims
- 0978US7196010B2Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 27, 2007·16 cites·34 claims
- 1074US6769973B2Polishing head of chemical mechanical polishing apparatus and polishing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 3, 2004·12 cites·7 claims
- 1173US6840846B2Polishing station of a chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 11, 2005·16 cites·11 claims
- 1269US8882563B2Chemical mechanical polishing systemBOO JAE PHIL·Filed 2011·Granted Nov 11, 2014·4 cites·9 claims
- 1367US7196011B2Apparatus and method for treating substratesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 27, 2007·6 cites·29 claims
- 1466US7052368B2Polishing pad for chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 30, 2006·10 cites·17 claims
- 1566US6921323B2Apparatus for polishing a semiconductor wafer and method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 26, 2005·7 cites·32 claims
- 1664US7303466B2Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zonesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 4, 2007·13 cites·27 claims
- 1764US6709920B2Method of fabricating a non-volatile memory device having a tunnel-insulating layer including more than two portions of different thicknessSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 23, 2004·10 cites·8 claims
- 1858US6881135B2Polishing head of chemical mechanical polishing apparatus and polishing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 19, 2005·5 cites·22 claims
- 1955US2007232209A1Method for polishing a semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2045US9421668B2CMP apparatusLEE SEH KWANG·Filed 2012·Granted Aug 23, 2016·0 cites·14 claims
- 2144US8790158B2Chemical mechanical polishing apparatusCHANG ONE-MOON·Filed 2011·Granted Jul 29, 2014·0 cites·19 claims
- 2242US9314901B2CMP pad conditioner, and method for producing the CMP pad conditionerLEE SEH KWANG·Filed 2012·Granted Apr 19, 2016·0 cites·15 claims
- 2339US9620392B2Single type apparatus for drying a substrate and single type system for cleaning a substrate including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 11, 2017·0 cites·21 claims
- 2425US2012247508A1Brush and method for cleaning a substrate and scrubber employing the sameJEUNG GUN-IG·Filed 2012·Application pending·0 cites
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