Inventor · disambiguated record
Sylvain Jeanneret
Also filed as: JEANNERET SYLVAIN
9 granted patents·2 pending applications·64 citations·filing 1994–2023
84Inventor score
Files withPATEK PHILIPPE SA GENEVE7BARROT FRANCOIS1MAIER FREDERIC1SUISSE ELECTRONIQUE MICROTECH1UNIV NEUCHATEL1
Top patents by PatentIndex Score
11 records- 0183US2024103442A1Support member for supporting a wafer during a heat treatmentPATEK PHILIPPE SA GENEVE·Filed 2023·Application pending·0 cites
- 0278US9770771B2Method for freeing a micromechanical part and a micromechanical part comprising sacrificial fastenersBARROT FRANCOIS·Filed 2012·Granted Sep 26, 2017·9 cites·13 claims
- 0374US5462839AProcess for the manufacture of a micromachined device to contain or convey a fluidUNIV NEUCHATEL·Filed 1994·Granted Oct 31, 1995·39 cites·3 claims
- 0468US8636403B2Timepiece component and method for making sameMAIER FREDERIC·Filed 2008·Granted Jan 28, 2014·6 cites·9 claims
- 0562US11880165B2Method for manufacturing silicon timepiece componentsPATEK PHILIPPE SA GENEVE·Filed 2019·Granted Jan 23, 2024·0 cites·17 claims
- 0658US11703804B2Method for manufacturing timepiece thermocompensated hairsprings of precise stiffnessPATEK PHILIPPE SA GENEVE·Filed 2019·Granted Jul 18, 2023·0 cites·12 claims
- 0755US11796966B2Method for producing a silicon-based timepiece springPATEK PHILIPPE SA GENEVE·Filed 2018·Granted Oct 24, 2023·0 cites·20 claims
- 0855US9342053B2Method for making a timepiece componentPATEK PHILIPPE SA GENEVE·Filed 2013·Granted May 17, 2016·0 cites·15 claims
- 0949US2023126149A1Method for manufacturing a silicon-based timepiece componentPATEK PHILIPPE SA GENEVE·Filed 2021·Application pending·0 cites
- 1043US11829107B2Micro-mechanical timepiece partPATEK PHILIPPE SA GENEVE·Filed 2019·Granted Nov 28, 2023·0 cites·20 claims
- 1132US6056887AProcess for fabricating a feeler member for a micromechanical probe, in particular for an atomic force microscopeSUISSE ELECTRONIQUE MICROTECH·Filed 1998·Granted May 2, 2000·10 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →