Inventor · disambiguated record
Hideki Okumura
Also filed as: OKUMURA HIDEKI
48 granted patents·28 pending applications·425 citations·filing 1995–2025
98Inventor score
Files withTOSHIBA KK31SEIKO EPSON CORP20HONDA MOTOR CO LTD4MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4OKUMURA HIDEKI4
Top patents by PatentIndex Score
76 records- 0199US10889123B2Ink refill container, ink refill system, and ink refill adapterSEIKO EPSON CORP·Filed 2020·Granted Jan 12, 2021·7 cites·23 claims
- 0298US11179944B2Ink refill container, ink refill system, and ink refill adapterSEIKO EPSON CORP·Filed 2020·Granted Nov 23, 2021·3 cites·22 claims
- 0397US11090945B2Liquid discharge apparatusSEIKO EPSON CORP·Filed 2020·Granted Aug 17, 2021·4 cites·10 claims
- 0497US10308029B2Liquid holding unit and liquid ejection deviceSEIKO EPSON CORP·Filed 2017·Granted Jun 4, 2019·12 cites·16 claims
- 0596US10717287B2Ink refill container, ink refill system, and ink refill adapterSEIKO EPSON CORP·Filed 2017·Granted Jul 21, 2020·6 cites·20 claims
- 0694US10300703B2Printer with a printing head for ejecting inkSEIKO EPSON CORP·Filed 2018·Granted May 28, 2019·5 cites·12 claims
- 0794US6740931B2Semiconductor deviceTOSHIBA KK·Filed 2003·Granted May 25, 2004·95 cites·44 claims
- 0892US9865680B2Semiconductor device with peripheral void space and method of making the sameTOSHIBA KK·Filed 2016·Granted Jan 9, 2018·9 cites·20 claims
- 0991US10752009B2Liquid tank and liquid ejection deviceSEIKO EPSON CORP·Filed 2019·Granted Aug 25, 2020·3 cites·18 claims
- 1091US8710582B2Semiconductor device and method for manufacturing sameOKUMURA HIDEKI·Filed 2012·Granted Apr 29, 2014·16 cites·10 claims
- 1190US12296600B2Ink refill container, ink refill system, and ink refill adapterSEIKO EPSON CORP·Filed 2024·Granted May 13, 2025·0 cites·40 claims
- 1290US6060747ASemiconductor deviceTOSHIBA KK·Filed 1998·Granted May 9, 2000·80 cites·17 claims
- 1387US7420245B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2005·Granted Sep 2, 2008·12 cites·12 claims
- 1486US11938739B2Ink refill container, ink refill system, and ink refill adapterSEIKO EPSON CORP·Filed 2023·Granted Mar 26, 2024·0 cites·16 claims
- 1586US7850263B2Liquid consumption apparatus and liquid consumption amount control methodSEIKO EPSON CORP·Filed 2007·Granted Dec 14, 2010·8 cites·15 claims
- 1686US6578949B2Ink jet recording device and method of driving and controlling the sameSEIKO EPSON CORP·Filed 2001·Granted Jun 17, 2003·36 cites·19 claims
- 1786US2025236113A1Ink refill container, ink refill system, and ink refill adapterSEIKO EPSON CORP·Filed 2025·Application pending·0 cites
- 1884US7301202B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2005·Granted Nov 27, 2007·11 cites·19 claims
- 1983US6995426B2Semiconductor device having vertical metal insulator semiconductor transistors having plural spatially overlapping regions of different conductivity typeTOSHIBA KK·Filed 2002·Granted Feb 7, 2006·27 cites·16 claims
- 2082US8859365B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2014·Granted Oct 14, 2014·4 cites·10 claims
- 2180US11639060B2Ink refill container, ink refill system, and ink refill adapterSEIKO EPSON CORP·Filed 2021·Granted May 2, 2023·0 cites·20 claims
- 2275US10431491B2Semiconductor device having a triple insulating film surrounded voidTOSHIBA KK·Filed 2018·Granted Oct 1, 2019·2 cites·18 claims
- 2369US6265744B1Semiconductor device having a trench structure and method for manufacturing the sameTOSHIBA KK·Filed 1999·Granted Jul 24, 2001·28 cites·12 claims
- 2467US8025357B2Fluid ejecting apparatus and ejecting head maintenance methodSEIKO EPSON CORP·Filed 2008·Granted Sep 27, 2011·2 cites·7 claims
- 2564US11072180B2Ink tankSEIKO EPSON CORP·Filed 2019·Granted Jul 27, 2021·0 cites·7 claims
- 2663US7423315B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2005·Granted Sep 9, 2008·3 cites·20 claims
- 2761US7075149B2Semiconductor device and its manufacturing methodTOSHIBA KK·Filed 2004·Granted Jul 11, 2006·10 cites·18 claims
- 2860US5701225ATape cassette having a minimized clamp setMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Dec 23, 1997·16 cites·5 claims
- 2959US7700998B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2008·Granted Apr 20, 2010·2 cites·5 claims
- 3058US9142667B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2014·Granted Sep 22, 2015·0 cites·13 claims
- 3158US7262477B2Semiconductor deviceTOSHIBA KK·Filed 2003·Granted Aug 28, 2007·6 cites·26 claims
- 3257US2024051986A1Method for producing nucleic acid oligomerSUMITOMO CHEMICAL CO·Filed 2021·Application pending·0 cites
- 3356US12509483B2Method for producing nucleic acid oligomersSUMITOMO CHEMICAL CO·Filed 2020·Granted Dec 30, 2025·0 cites·22 claims
- 3453US8006878B2Splitting method and device for connecting rodHONDA MOTOR CO LTD·Filed 2005·Granted Aug 30, 2011·3 cites·9 claims
- 3551US2023242570A1Method for producing nucleic acid oligomerSUMITOMO CHEMICAL CO·Filed 2021·Application pending·0 cites
- 3650US7391077B2Vertical type semiconductor deviceTOSHIBA KK·Filed 2004·Granted Jun 24, 2008·4 cites·8 claims
- 3749US11325386B2Liquid container device and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2020·Granted May 10, 2022·0 cites·6 claims
- 3849US10490628B2Semiconductor deviceTOSHIBA KK·Filed 2018·Granted Nov 26, 2019·0 cites·18 claims
- 3949US10173432B2PrinterSEIKO EPSON CORP·Filed 2018·Granted Jan 8, 2019·0 cites·8 claims
- 4048US10886084B2Pressure switch and hermetically sealed electric compressorUBUKATA IND CO LTD·Filed 2019·Granted Jan 5, 2021·0 cites·6 claims
- 4148US2013334598A1Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2013·Application pending·0 cites
- 4247US12480486B2Pressure switch with two pressing members and a hermetic electric compressor arrangement therewithUBUKATA IND CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·7 claims
- 4347US10618297B2Tank and liquid ejection deviceSEIKO EPSON CORP·Filed 2018·Granted Apr 14, 2020·0 cites·8 claims
- 4447US2015179764A1Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2015·Application pending·0 cites
- 4547US2004123646A1Gas permeability measurement method and gas permeability measurement deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 4646US10020362B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2016·Granted Jul 10, 2018·0 cites·16 claims
- 4746US7596994B2Device and method for inspecting connecting rodHONDA MOTOR CO LTD·Filed 2005·Granted Oct 6, 2009·1 cites·8 claims
- 4846US2005129860A1Method and apparatus for preparing thin resin filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 4944US6010950AMethod of manufacturing semiconductor bonded substrateTOSHIBA KK·Filed 1998·Granted Jan 4, 2000·10 cites·1 claims
- 5044US2009250859A1Method and Device for Manufacture of Connecting RodHONDA MOTOR CO LTD·Filed 2006·Application pending·0 cites
Showing the top 50 of 76 patent records by PatentIndex Score.
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