Inventor · disambiguated record
Yong-Chai Kwon
Also filed as: KWON YONG-CHAI
17 granted patents·7 pending applications·210 citations·filing 2005–2021
94Inventor score
Files withSAMSUNG ELECTRONICS CO LTD20KWON YONG-CHAI2FOUND RES & BUSINESS SEOUL NAT UNIV SCI & TECH1LEE KANG-WOOK1
Top patents by PatentIndex Score
24 records- 0196US7915710B2Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrateSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 29, 2011·45 cites·2 claims
- 0295US7262475B2Image sensor device and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 28, 2007·30 cites·8 claims
- 0389US7939947B2Semiconductor package structureSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted May 10, 2011·10 cites·7 claims
- 0489US7777323B2Semiconductor structure and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 17, 2010·19 cites·22 claims
- 0589US7588964B2Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 15, 2009·18 cites·13 claims
- 0687US7732328B2Method of fabricating semiconductor package structureSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 8, 2010·13 cites·12 claims
- 0787US7459774B2Stacked chip package using photosensitive polymer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 2, 2008·23 cites·13 claims
- 0885US7884875B2Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 8, 2011·13 cites·25 claims
- 0985US7602047B2Semiconductor device having through viasSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 13, 2009·13 cites·8 claims
- 1084US7777345B2Semiconductor device having through electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 17, 2010·12 cites·12 claims
- 1177US7825468B2Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 2, 2010·6 cites·10 claims
- 1271US7534656B2Image sensor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 19, 2009·2 cites·12 claims
- 1363US8367472B2Method of fabricating a 3-D deviceSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Feb 5, 2013·1 cites·12 claims
- 1462US8053807B2Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Nov 8, 2011·1 cites·15 claims
- 1558US7521657B2Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 21, 2009·2 cites·21 claims
- 1658US7371614B2Image sensor device and methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 13, 2008·2 cites·20 claims
- 1753US11489184B2Electrolyte including mixture of active material and precursor thereofFOUND RES & BUSINESS SEOUL NAT UNIV SCI & TECH·Filed 2021·Granted Nov 1, 2022·0 cites·9 claims
- 1847US2009186446A1Semiconductor device packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1946US2008318363A1Stack circuit member and methodKWON YONG-CHAI·Filed 2008·Application pending·0 cites
- 2045US2008179734A1Stacked package, method of manufacturing the same, and memory card having the stacked packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2145US2008179727A1Semiconductor packages having immunity against void due to adhesive material and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2244US2009121323A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2342US2006278991A1Stack circuit member and methodKWON YONG-CHAI·Filed 2005·Application pending·0 cites
- 2440US2007007641A1Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structureLEE KANG-WOOK·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →