Inventor · disambiguated record
Michael Wentling
Also filed as: WENTLING MICHAEL
3 granted patents·286 citations·filing 1993–1995
79Inventor score
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0186US5545922ADual sided integrated circuit chip package with offset wire bonds and support block cavitiesINTEL CORP·Filed 1995·Granted Aug 13, 1996·92 cites·3 claims
- 0286US5366933AMethod for constructing a dual sided, wire bonded integrated circuit chip packageINTEL CORP·Filed 1993·Granted Nov 22, 1994·120 cites·19 claims
- 0383US5527740AManufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavitiesINTEL CORP·Filed 1994·Granted Jun 18, 1996·74 cites·25 claims
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