Inventor · disambiguated record
Richard Foehringer
Also filed as: FOEHRINGER RICHARD · FOEHRINGER RICHARD B · FOEHRINGER RICHARD BERNARD
9 granted patents·3 pending applications·381 citations·filing 1993–2005
91Inventor score
Top patents by PatentIndex Score
12 records- 0186US5545922ADual sided integrated circuit chip package with offset wire bonds and support block cavitiesINTEL CORP·Filed 1995·Granted Aug 13, 1996·92 cites·3 claims
- 0286US5366933AMethod for constructing a dual sided, wire bonded integrated circuit chip packageINTEL CORP·Filed 1993·Granted Nov 22, 1994·120 cites·19 claims
- 0383US5527740AManufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavitiesINTEL CORP·Filed 1994·Granted Jun 18, 1996·74 cites·25 claims
- 0478US6469482B1Inductive charge pump circuit for providing voltages useful for flash memory and other applicationsINTEL CORP·Filed 2000·Granted Oct 22, 2002·28 cites·52 claims
- 0575US7533457B2Packaging method for circuit boardINTEL CORP·Filed 2005·Granted May 19, 2009·7 cites·18 claims
- 0664US6489557B2Implementing micro BGA™ assembly techniques for small dieINTEL CORP·Filed 1999·Granted Dec 3, 2002·34 cites·18 claims
- 0756US6744669B2Memory circuit including booster pump for programming voltage generationINTEL CORP·Filed 2002·Granted Jun 1, 2004·9 cites·22 claims
- 0851US6812566B2Lower profile package with power supply in packageINTEL CORP·Filed 2002·Granted Nov 2, 2004·6 cites·16 claims
- 0940US6655022B1Implementing micro BGA assembly techniques for small dieINTEL CORP·Filed 1998·Granted Dec 2, 2003·11 cites·11 claims
- 1037US2007005839A1Port expander device and methodFOEHRINGER RICHARD B·Filed 2005·Application pending·0 cites
- 1136US2004119151A1Pre-applied underfillINTEL CORP·Filed 2002·Application pending·0 cites
- 1226US2003122216A1Memory device packaging including stacked passive devices and method for making the sameFiled 2001·Application pending·0 cites
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