Inventor · disambiguated record

Kun-Yao Ho

Also filed as: HO KUN-YAO

1 granted patent·37 citations·filing 2002–2002

46Inventor score

Technology areasH05K

Files withVIA TECH INC1

Top patents by PatentIndex Score

1 record

0181US7101781B2Integrated circuit packages without solder mask and method for the sameVIA TECH INC·Filed 2002·Granted Sep 5, 2006·37 cites·21 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →