Inventor
HORVATH JANIS
US17 patents
⚠️ This page may combine multiple inventors who share the name “HORVATH JANIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD CO
9 patentsUS6341845B1Jan 29, 2002
Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies
HEWLETT PACKARD CO248 citations99
US6450614B1Sep 17, 2002
Printhead die alignment for wide-array inkjet printhead assembly
HEWLETT PACKARD CO93 citations98
US6350013B1Feb 26, 2002
Carrier positioning for wide-array inkjet printhead assembly
HEWLETT PACKARD CO132 citations98
US6543880B1Apr 8, 2003
Inkjet printhead assembly having planarized mounting layer for printhead dies
HEWLETT PACKARD CO126 citations96
US6464333B1Oct 15, 2002
Inkjet printhead assembly with hybrid carrier for printhead dies
HEWLETT PACKARD CO56 citations96
US6520624B1Feb 18, 2003
Substrate with fluid passage supports
HEWLETT PACKARD CO24 citations91
US6431683B1Aug 13, 2002
Hybrid carrier for wide-array inkjet printhead assembly
HEWLETT PACKARD CO43 citations91
US6409307B1Jun 25, 2002
Coplanar mounting of printhead dies for wide-array inkjet printhead assembly
HEWLETT PACKARD CO23 citations91
US6523940B2Feb 25, 2003
Carrier for fluid ejection device
HEWLETT PACKARD CO12 citations74
HEWLETT PACKARD DEVELOPMENT CO
8 patentsUS6557976B2May 6, 2003
Electrical circuit for wide-array inkjet printhead assembly
HEWLETT PACKARD DEVELOPMENT CO317 citations98
US6997540B2Feb 14, 2006
Substrate for fluid ejection devices
HEWLETT PACKARD DEVELOPMENT CO36 citations92
US6705705B2Mar 16, 2004
Substrate for fluid ejection devices
HEWLETT PACKARD DEVELOPMENT CO23 citations92
US6575559B2Jun 10, 2003
Joining of different materials of carrier for fluid ejection devices
HEWLETT PACKARD DEVELOPMENT CO23 citations92
US6951778B2Oct 4, 2005
Edge-sealed substrates and methods for effecting the same
HEWLETT PACKARD DEVELOPMENT CO25 citations89
US6843552B2Jan 18, 2005
Electrical circuit for printhead assembly
HEWLETT PACKARD DEVELOPMENT CO7 citations73
US6880246B2Apr 19, 2005
Method of forming substrate with fluid passage supports
HEWLETT PACKARD DEVELOPMENT CO7 citations72
US6679581B2Jan 20, 2004
Surface deformation of carrier for printhead dies
HEWLETT PACKARD DEVELOPMENT CO0 citations48