Inventor · disambiguated record
Lewis Shen
Also filed as: SHEN LEWIS · SHEN LEWIS N
35 granted patents·1,091 citations·filing 1987–2003
98Inventor score
Files withADVANCED MICRO DEVICES INC35
Top patents by PatentIndex Score
35 records- 0196US6372651B1Method for trimming a photoresist pattern line for memory gate etchingADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 16, 2002·220 cites·5 claims
- 0296US4847674AHigh speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanismADVANCED MICRO DEVICES INC·Filed 1987·Granted Jul 11, 1989·236 cites·28 claims
- 0384US4962060AMaking a high speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanismADVANCED MICRO DEVICES INC·Filed 1989·Granted Oct 9, 1990·67 cites·32 claims
- 0480US5795829AMethod of high density plasma metal etchingADVANCED MICRO DEVICES INC·Filed 1996·Granted Aug 18, 1998·61 cites·16 claims
- 0575US5013675AMethod of forming and removing polysilicon lightly doped drain spacersADVANCED MICRO DEVICES INC·Filed 1989·Granted May 7, 1991·32 cites·8 claims
- 0674US6867097B1Method of making a memory cell with polished insulator layerADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 15, 2005·45 cites·10 claims
- 0773US6878622B1Method for forming SAC using a dielectric as a BARC and FICD enlargerADVANCED MICRO DEVICES INC·Filed 2003·Granted Apr 12, 2005·16 cites·10 claims
- 0871US6365509B1Semiconductor manufacturing method using a dielectric photomaskADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 2, 2002·18 cites·12 claims
- 0971US5973353AMethods and arrangements for forming a tapered floating gate in non-volatile memory semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1997·Granted Oct 26, 1999·30 cites·11 claims
- 1068US5948703AMethod of soft-landing gate etching to prevent gate oxide damageADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 7, 1999·34 cites·17 claims
- 1166US5665641AMethod to prevent formation of defects during multilayer interconnect processingADVANCED MICRO DEVICES INC·Filed 1995·Granted Sep 9, 1997·32 cites·7 claims
- 1265US5977601AMethod for etching memory gate stack using thin resist layerADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 2, 1999·25 cites·4 claims
- 1364US6271154B1Methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profileADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 7, 2001·28 cites·16 claims
- 1459US6159860AMethod for etching layers on a semiconductor wafer in a single etching chamberADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 12, 2000·23 cites·5 claims
- 1558US6352930B1Bilayer anti-reflective coating and etch hard maskADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 5, 2002·5 cites·10 claims
- 1656US6586339B1Silicon barrier layer to prevent resist poisoningADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 1, 2003·19 cites·8 claims
- 1756US6515328B1Semiconductor devices with reduced control gate dimensionsADVANCED MICRO DEVICES INC·Filed 1999·Granted Feb 4, 2003·20 cites·10 claims
- 1855US6383939B1Method for etching memory gate stack using thin resist layerADVANCED MICRO DEVICES INC·Filed 1999·Granted May 7, 2002·16 cites·21 claims
- 1954US6110779AMethod and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitrideADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 29, 2000·15 cites·14 claims
- 2052US6534411B1Method of high density plasma metal etchingADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 18, 2003·3 cites·17 claims
- 2152US6011289AMetal oxide stack for flash memory applicationADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 4, 2000·12 cites·8 claims
- 2249US6074956AMethod for preventing silicide residue formation in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1998·Granted Jun 13, 2000·14 cites·5 claims
- 2349US5770518ASemiconductor device and method of manufacturing without undercutting conductive linesADVANCED MICRO DEVICES INC·Filed 1996·Granted Jun 23, 1998·15 cites·19 claims
- 2448US5702564AMethod of etching conductive lines without undercuttingADVANCED MICRO DEVICES INC·Filed 1995·Granted Dec 30, 1997·14 cites·27 claims
- 2547US6025268AMethod of etching conductive lines through an etch resistant photoresist maskADVANCED MICRO DEVICES INC·Filed 1996·Granted Feb 15, 2000·13 cites·19 claims
- 2647US5675186AConstruction that prevents the undercut of interconnect lines in plasma metal etch systemsADVANCED MICRO DEVICES INC·Filed 1996·Granted Oct 7, 1997·13 cites·4 claims
- 2746US6159794AMethods for removing silicide residue in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 12, 2000·12 cites·19 claims
- 2843US6355546B1Thermally grown protective oxide buffer layer for ARC removalADVANCED MICRO DEVICES INC·Filed 1999·Granted Mar 12, 2002·9 cites·19 claims
- 2942US5604381ASemiconductor device and method of manufacturing without undercutting conductive linesADVANCED MICRO DEVICES INC·Filed 1995·Granted Feb 18, 1997·10 cites·9 claims
- 3041US6452225B1Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitrideADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 17, 2002·3 cites·4 claims
- 3141US6232002B1Bilayer anti-reflective coating and etch hard maskADVANCED MICRO DEVICES INC·Filed 1998·Granted May 15, 2001·7 cites·7 claims
- 3239US6291329B1Protective oxide buffer layer for ARC removalADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 18, 2001·6 cites·8 claims
- 3339US6218310B1RTA methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profileADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 17, 2001·7 cites·20 claims
- 3438US6174819B1Low temperature photoresist removal for rework during metal mask formationADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 16, 2001·7 cites·12 claims
- 3532US5688717AConstruction that prevents the undercut of interconnect lines in plasma metal etch systemsADVANCED MICRO DEVICES INC·Filed 1995·Granted Nov 18, 1997·4 cites·15 claims
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