Inventor · disambiguated record
Akira Tokumitsu
Also filed as: TOKUMITSU AKIRA
6 granted patents·134 citations·filing 1989–2007
83Inventor score
Top patents by PatentIndex Score
6 records- 0193US4937133AFlexible base materials for printed circuitsNIPPON STEEL CHEMICAL CO·Filed 1989·Granted Jun 26, 1990·89 cites·9 claims
- 0284US6887580B2Adhesive polyimide resin and adhesive laminateNIPPON STEEL CHEMICAL CO·Filed 2001·Granted May 3, 2005·23 cites·9 claims
- 0376US7410829B2Method of fabricating a semiconductor chip packageOKI ELECTRIC IND CO LTD·Filed 2007·Granted Aug 12, 2008·7 cites·6 claims
- 0464US7304395B2Semiconductor chip packageOKI ELECTRIC IND CO LTD·Filed 2006·Granted Dec 4, 2007·3 cites·11 claims
- 0542US7489043B2Semiconductor chip package and fabrication method thereofOKI ELECTRIC IND CO LTD·Filed 2006·Granted Feb 10, 2009·0 cites·5 claims
- 0642US5916688AResin solution compositions for electronic materials and protective membranes prepared therefrom for circuits in printed wiring boardsNIPPON STEEL CHEMICAL CO·Filed 1998·Granted Jun 29, 1999·12 cites·5 claims
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