Inventor · disambiguated record
K. Lin
Also filed as: LIN K T · LIN K Y
1 granted patent·1 pending application·31 citations·filing 1995–2005
44Inventor score
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2 records- 0157US5684332AMethod of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefromADVANCED SEMICONDUCTOR ENG·Filed 1995·Granted Nov 4, 1997·31 cites·4 claims
- 0246US2006237320A1Method for forming a metal layer in multiple stepsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
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