Inventor · disambiguated record
James E. Drye
Also filed as: DRYE JAMES E
11 granted patents·432 citations·filing 1984–2008
92Inventor score
Top patents by PatentIndex Score
11 records- 0194US4630096AHigh density IC module assemblyMOTOROLA INC·Filed 1984·Granted Dec 16, 1986·118 cites·11 claims
- 0292US5198963AMultiple integrated circuit module which simplifies handling and testingMOTOROLA INC·Filed 1991·Granted Mar 30, 1993·176 cites·15 claims
- 0382US4722914AMethod of making a high density IC module assemblyMOTOROLA INC·Filed 1986·Granted Feb 2, 1988·63 cites·12 claims
- 0462US6906406B2Multiple dice packageFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jun 14, 2005·11 cites·10 claims
- 0556US7969164B2Method and apparatus for mini module EMI shielding evaluationFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jun 28, 2011·2 cites·20 claims
- 0642US4592794AGlass bonding methodMOTOROLA INC·Filed 1985·Granted Jun 3, 1986·12 cites·16 claims
- 0740US5164885AElectronic package having a non-oxide ceramic bonded to metal and method for makingMOTOROLA INC·Filed 1991·Granted Nov 17, 1992·11 cites·15 claims
- 0840US4890156AMultichip IC module having coplanar dice and substrateMOTOROLA INC·Filed 1988·Granted Dec 26, 1989·12 cites·8 claims
- 0938US4800421AGlass bonding means and methodMOTOROLA INC·Filed 1986·Granted Jan 24, 1989·9 cites·6 claims
- 1038US4515898AGlass bonding means and methodMOTOROLA INC·Filed 1984·Granted May 7, 1985·8 cites·3 claims
- 1137US4792533ACoplanar die to substrate bond methodMOTOROLA INC·Filed 1987·Granted Dec 20, 1988·10 cites·14 claims
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