Inventor · disambiguated record
Hideki Sekine
Also filed as: SEKINE HIDEKI
3 granted patents·10 citations·filing 1987–2007
60Inventor score
Top patents by PatentIndex Score
3 records- 0166US7522269B2Bonded part peeling shape identification deviceFUJI HEAVY IND LTD·Filed 2007·Granted Apr 21, 2009·6 cites·19 claims
- 0240US7991215B2Element splitting method, element splitting arithmetic device and damage extension analysis deviceFUJI HEAVY IND LTD·Filed 2007·Granted Aug 2, 2011·0 cites·17 claims
- 0329US4759214AMethod for determining fracture toughness of rock by core boringUNIV TOHOKU·Filed 1987·Granted Jul 26, 1988·4 cites·1 claims
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