Inventor · disambiguated record
Heidi Baks
Also filed as: BAKS HEIDI · BAKS HEIDI LEE
2 granted patents·3 pending applications·23 citations·filing 2004–2008
61Inventor score
Technology areasH10P
Top patents by PatentIndex Score
5 records- 0184US7358182B2Method of forming an interconnect structureIBM·Filed 2005·Granted Apr 15, 2008·11 cites·11 claims
- 0266US7326651B2Method for forming damascene structure utilizing planarizing material coupled with compressive diffusion barrier materialIBM·Filed 2004·Granted Feb 5, 2008·12 cites·30 claims
- 0350US2008146029A1Method of forming an interconnect structureBAKS HEIDI LEE·Filed 2008·Application pending·0 cites
- 0440US2009176367A1OPTIMIZED SiCN CAPPING LAYERBAKS HEIDI·Filed 2008·Application pending·0 cites
- 0538US2007155186A1OPTIMIZED SiCN CAPPING LAYERCHARTERED SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →