Inventor · disambiguated record
Kazuo Ouchi
Also filed as: OUCHI KAZUO
15 granted patents·3 pending applications·572 citations·filing 1989–2016
94Inventor score
Files withNITTO DENKO CORP17
Top patents by PatentIndex Score
18 records- 0193US5072289AWiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor deviceNITTO DENKO CORP·Filed 1989·Granted Dec 10, 1991·91 cites·16 claims
- 0289US6379159B1Interposer for chip size package and method for manufacturing the sameNITTO DENKO CORP·Filed 2000·Granted Apr 30, 2002·40 cites·11 claims
- 0389US5374469AFlexible printed substrateNITTO DENKO CORP·Filed 1992·Granted Dec 20, 1994·116 cites·46 claims
- 0483US5821626AFilm carrier, semiconductor device using same and method for mounting semiconductor elementNITTO DENKO CORP·Filed 1996·Granted Oct 13, 1998·71 cites·15 claims
- 0582US5877559AFilm carrier for fine-pitched and high density mounting and semiconductor device using sameNITTO DENKO CORP·Filed 1996·Granted Mar 2, 1999·71 cites·9 claims
- 0679US5575662AMethods for connecting flexible circuit substrates to contact objects and structures thereofNITTO DENKO CORP·Filed 1994·Granted Nov 19, 1996·64 cites·6 claims
- 0769US5136359AAnisotropic conductive film with through-holes filled with metallic materialNITTO DENKO CORP·Filed 1990·Granted Aug 4, 1992·30 cites·4 claims
- 0867US6222272B1Film carrier and semiconductor device using sameNITTO DENKO CORP·Filed 1998·Granted Apr 24, 2001·29 cites·14 claims
- 0956US5188702AProcess for producing an anisotropic conductive filmNITTO DENKO CORP·Filed 1992·Granted Feb 23, 1993·19 cites·2 claims
- 1054US6011310AFilm carrier and semiconductor device using the sameNITTO DENKO CORP·Filed 1996·Granted Jan 4, 2000·19 cites·5 claims
- 1153US7632599B2Separator for fuel cell and fuel cell using the sameNITTO DENKO CORP·Filed 2004·Granted Dec 15, 2009·1 cites·14 claims
- 1249US6538209B1Substrate for mounting semiconductor element having circuit patterns, and an insulating layer made of photosensitive and thermally-melting type adhesive resinNITTO DENKO CORP·Filed 1999·Granted Mar 25, 2003·13 cites·10 claims
- 1343US6017438AMethod for producing circuit substrate having bump contact point and jet stream type plating apparatus used thereforNITTO DENKO CORP·Filed 1997·Granted Jan 25, 2000·6 cites·6 claims
- 1442US2003219608A1Metal transfer sheet, producing method thereof, and producing method of ceramic condenserFiled 2003·Application pending·0 cites
- 1540US10867729B2Method for producing sintered body that forms rare-earth permanent magnet and has non-parallel easy magnetization axis orientationNITTO DENKO CORP·Filed 2016·Granted Dec 15, 2020·0 cites·28 claims
- 1637US2005030696A1Thin metal layers-having ceramic green sheet and method for producing ceramic capacitorNITTO DENKO CORP·Filed 2003·Application pending·0 cites
- 1736US2004079474A1Production method of anisotropic conductive connectorNITTO DENKO CORP·Filed 2002·Application pending·0 cites
- 1831US5330825APrinted circuit substrate with projected electrode and connection methodNITTO DENKO CORP·Filed 1993·Granted Jul 19, 1994·2 cites·3 claims
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